Chuck Top Angle Adjustment for Wafer Inspection Alignment
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Solution Overview
Problem
Existing wafer inspection systems face challenges in maintaining the horizontal alignment of chuck tops, which can lead to misalignment and damage of wafers due to aging or individual differences in the aligner stages and chuck top deformation, affecting the accuracy and reliability of inspections.
Innovation Solution
An inspection apparatus equipped with a measurement device to determine height positions on chuck tops, a calculation device to calculate adjustment amounts, and an adjustment mechanism that adjusts the angle of each chuck top to ensure its surface remains horizontal, using actuators to support the chuck top at multiple points and adjust lengths to align the surface with a reference plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chuck tops are used for wafer inspection, then inspection capability is provided, but misalignment and damage of wafers occur due to aging or individual differences in aligner stages and chuck top deformation
Solution Approach 1:
The patent performs preliminary measurement of chuck top surface heights using height measurement devices before inspection operations. The measurement data is used to calculate adjustment amounts in advance, and the adjustment mechanism pre-adjusts the chuck top angles to compensate for aging and individual differences, preventing misalignment before it occurs.
Solution Approach 2:
The patent implements a feedback loop where height measurement devices continuously monitor chuck top surface positions, the calculation device processes measurement data to determine adjustment amounts, and the adjustment mechanism modifies chuck top angles accordingly. This closed-loop system ensures ongoing compensation for deformation and aging effects.
2Manufacturing precision
If adjustment mechanism is added to correct chuck top alignment, then inspection accuracy is improved, but device complexity increases
Solution Approach 1:
The adjustment mechanism is designed to handle multiple functions: it adjusts chuck top angles, compensates for aging effects, corrects individual differences between chuck tops, and maintains horizontal alignment. By consolidating these functions into a single mechanism with coordinated control, the patent reduces overall system complexity compared to having separate adjustment systems for each function.
Solution Approach 2:
The patent replaces complex mechanical alignment procedures with an automated system combining height measurement devices, calculation devices that process data to determine adjustment amounts, and adjustment mechanisms that execute precise angular corrections. This substitution of manual mechanical adjustment with automated measurement-and-computation-driven adjustment simplifies the overall system.
Data Source
AI summary
An inspection apparatus includes: a plurality of inspection devices configured to respectively inspect electronic devices of inspection objects on a plurality of chuck tops; a measurement device configured to measure height positions of a plurality of points on a surface of each of the plurality of chuck tops, which are respectively disposed to correspond to the plurality of inspection devices, or to measure distances in a height direction from a measurement reference point to the plurality of points; a calculation device configured to calculate adjustment amounts in the height direction at the plurality of points of each chuck top, based on the height positions of the plurality of points or the distances in the height direction from the measurement reference point to the plurality of points; and an adjustment mechanism configured to adjust, for each chuck top, an angle of the respective chuck top based on the adjustment amounts.