Chuck Top Drop Prevention Hook for Wafer Inspection
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Solution Overview
Problem
Existing chuck top designs for semiconductor wafer inspection systems require separate support mechanisms for drop prevention, which occupy additional space and complicate camera alignment, increasing the overall size of the inspection apparatus.
Innovation Solution
Integration of a movable drop prevention hook within the chuck top itself, which engages with the pogo frame to prevent dropping when power is lost, allowing for automatic recovery and reducing the need for external support structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate support mechanisms are provided to prevent the chuck top from dropping, then the reliability of preventing damage is improved, but the device complexity and overall size increase
Solution Approach 1:
The patent integrates the drop prevention function directly into the chuck top structure by providing a hook-shaped protrusion that engages with the frame. This merging of the drop prevention mechanism with the chuck top body eliminates the need for separate support mechanisms, thereby maintaining reliability while reducing device complexity and overall size.
2Reliability
If separate support mechanisms are provided to prevent the chuck top from dropping, then the reliability of preventing damage is improved, but the area occupied by the apparatus increases
Solution Approach 1:
The drop prevention hook is integrated into the chuck top body, eliminating the need for external support structures that would occupy additional space. This integration maintains the reliability of drop prevention while reducing the overall area occupied by the apparatus.
3Reliability
If separate support mechanisms are provided to prevent the chuck top from dropping, then the reliability of preventing damage is improved, but the manufacturing precision requirements increase due to camera alignment complexity
Solution Approach 1:
By integrating the drop prevention hook into the chuck top structure, the patent eliminates separate support mechanisms that would complicate the optical path and camera alignment. This simplification reduces the manufacturing precision requirements for camera alignment while maintaining reliable drop prevention.
Data Source
AI summary
There is provided a chuck top for use in an inspection apparatus which inspects a plurality of inspection target devices formed on a wafer. The chuck top is configured to be held by a frame during an inspection of the plurality of inspection target devices while holding the wafer, the chuck top being configured to be attachable to and detachable from an aligner. The chuck top includes a main body, and a drop prevention mechanism provided in the main body and including a movable drop prevention hook configured to prevent the chuck top from being dropped when the chuck top is detached from the frame.