Chuck Vacuum Control for Irregular Substrate Height Fixation
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Solution Overview
Problem
The challenge of accurately controlling and securing substrates with irregular surface heights during manufacturing processes, such as transfer and exposure, is not adequately addressed in existing technologies, leading to potential failures and process inefficiencies.
Innovation Solution
A substrate is secured by a substrate is secured to a chuck using a substrate treatment apparatus that determines the appropriate vacuum pressure based on correlation data between substrate height and vacuum pressure, utilizing a height sensor, vacuum pump, and controller to stabilize the substrate on the chuck.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fixed vacuum pressure is applied to secure substrates to a chuck, then the substrate fixation is simple to implement, but substrates with irregular surface heights cannot be secured adequately
Solution Approach 1:
The vacuum pressure is dynamically adjusted based on the measured height of the substrate. The system transitions from a fixed vacuum pressure approach to a dynamic adjustment mechanism that modifies vacuum pressure according to substrate height variations, ensuring reliable fixation for substrates with irregular surfaces
Solution Approach 2:
A feedback control loop is implemented where the substrate height is measured by a sensor, the measured height is used to determine the appropriate vacuum pressure through a correlation model, and the vacuum pressure is adjusted accordingly. This closed-loop feedback ensures accurate substrate fixation despite height variations
2Reliability
If the vacuum pressure is increased to secure higher substrates, then substrates with greater height variations can be fixed, but the risk of substrate breakage increases
Solution Approach 1:
The system changes the vacuum pressure parameter dynamically based on substrate height measurements. By establishing a correlation between substrate height and required vacuum pressure, the system adjusts the pressure parameter to the minimum necessary level for secure fixation, avoiding excessive pressure that could cause substrate breakage
Solution Approach 2:
The substrate height is measured and the appropriate vacuum pressure is determined before the actual fixation process. This preliminary measurement and calculation allow the system to prepare the optimal vacuum pressure level, ensuring secure fixation while minimizing the risk of substrate damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively stabilizes substrates with varying heights, minimizing process failures and ensuring secure fixation during manufacturing processes.
Implementation Method 1
determine a flow amount of a fluid discharged by a vacuum pump to generate a vacuum pressure applied to secure the substrate to the chuck
Data Source
AI summary
A substrate treating method includes identifying correlation data between a height value of each of a plurality of reference substrates and a vacuum pressure applied to secure each of the plurality of reference substrates to a chuck, and determining, based on the correlation data and a height value of a substrate, a flow amount of a fluid discharged by a vacuum pump to produce a vacuum pressure applied to secure the substrate to the chuck.