Streamline Chucking Pin Vortex Prevention
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Solution Overview
Problem
Conventional chucking pins generate vortices and cause contamination by allowing cleaning solutions to reflow on the substrate during high-speed spinning processes due to their shape, which hinders smooth airflow and solution drainage.
Innovation Solution
A chucking member with a rotatable body and eccentric chucking pins having a streamline shape to prevent vortex formation and reflow of solutions, ensuring smooth airflow and solution drainage by positioning the chucking pin's tip to direct airflow and solution discharge effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a conventional chucking pin is used to mechanically fix the wafer edge, then the wafer can be held and rotated at high speed, but a vortex is generated at the rear end of the chucking pin due to air current flow, preventing smooth airflow outside the wafer
Solution Approach 1:
The chucking pin is designed with a streamlined shape featuring a curved surface that transitions from a rounded front end to a tapered rear end. This curvature allows air current to flow smoothly along the pin surface without separating, preventing vortex generation while maintaining high-speed wafer rotation capability
Solution Approach 2:
The shape parameters of the chucking pin are optimized by changing its geometric configuration from a conventional cylindrical form to a streamlined form with specific curvature ratios and length-to-diameter proportions, thereby altering airflow characteristics and eliminating vortex formation
2Reliability
If a conventional chucking pin approaches the wafer rear surface during chucking, then mechanical support is provided, but cleaning solution may reflow on the wafer rear surface causing contamination
Solution Approach 1:
The streamlined shape of the chucking pin creates a smooth airflow pattern that directs air current along the pin surface and away from the wafer rear surface, preventing cleaning solution from reflowing and contaminating the wafer during the chucking process
Solution Approach 2:
The streamlined chucking pin acts as an intermediary element that manages the interaction between air current, cleaning solution, and wafer surface, using its specific geometry to guide fluid flow and prevent harmful reflow while maintaining mechanical support
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The streamline-shaped chucking member prevents vortex generation and solution reflow, enhancing the efficiency of substrate spinning and cleaning processes by ensuring smooth airflow and effective solution drainage.
Implementation Method 1
a vortex is generated at the rear end of a chucking pin due to the shape of the chucking pin. A rotating wafer causes a vortex to be generated in a direction opposite to the rotation direction of the wafer
Implementation Method 2
the chucking pin has a streamline shape... ensuring smooth airflow
Implementation Method 3
While spinning a substrate such as a wafer at thousands of RPM... The supported wafer rotates at a high speed
Data Source
AI summary
A chucking member configured to chuck the edge of a substrate includes a chucking pin which is eccentric from the rotation center. The chucking pin has a streamline shape and includes a first front-end portion disposed at the front end relative to the flow of an air current generated by the rotation of the substrate and a first back-end portion disposed at the back end relative to the flow of the air current. The first front-end portion includes a first tip, and the first front-end portion has a round shape.