CIP Package RF Connector for Millimeter-Wave Signal Transmission
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Solution Overview
Problem
Conventional PCBA architectures are ineffective in transmitting millimeter-wave-level high frequency RF signals, and AIP packages have limited antenna module configuration due to placement restrictions on the chip package.
Innovation Solution
The CIP package integrates a semiconductor chip with an RF connector and a carrier substrate featuring an RF transmission circuit, allowing millimeter-wave-level high frequency RF signals to be transmitted directly, and enabling flexible placement and functionality of the antenna module through a remote connection using a coaxial cable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional PCBA architecture with internal PCB wiring is used, then the structure is simple and easy to manufacture, but it cannot effectively transmit millimeter-wave-level high frequency RF signals due to material limitations, wiring loss and design constraints
Solution Approach 1:
The patent extracts the RF signal transmission function from the PCB internal wiring and relocates it to an external RF connector. The RF connector is mounted on the PCB surface, allowing high frequency RF signals to be transmitted through dedicated RF transmission lines and connectors rather than through standard PCB traces, thereby resolving the contradiction between transmission capability and manufacturing ease
Solution Approach 2:
The patent introduces an RF connector as an intermediary component between the chip package and the external antenna module. This RF connector serves as a specialized mediator that handles millimeter-wave-level RF signals, while the standard PCB can continue to use conventional wiring for other functions, thus resolving the conflict between RF performance requirements and PCB manufacturing limitations
2Reliability
If AIP package mounts antenna module directly on chip package, then RF signal transmission at millimeter-wave frequencies is achieved, but the antenna module configuration is limited in terms of location, size, direction and functionality
Solution Approach 1:
The patent segments the RF signal transmission system into two independent parts: the chip package with integrated RF circuitry and the separate antenna module. These segments are connected via an RF connector and coaxial cable, allowing the antenna module to be independently configured and positioned anywhere on the PCB or even externally, thus achieving both millimeter-wave transmission capability and configuration flexibility
Solution Approach 2:
The patent transitions from the two-dimensional constraint of mounting the antenna directly on the chip package surface to a three-dimensional configuration where the antenna module can be positioned anywhere in the spatial volume around the device. The RF connector and coaxial cable provide the dimensional freedom, allowing the antenna to be placed at optimal locations for size, direction and functionality without being constrained by the chip package footprint
3Adaptability or versatility
If RF connector is integrated into the package with carrier substrate, then flexible antenna module placement is achieved, but the device complexity increases compared to conventional packages
Solution Approach 1:
The RF connector is designed as a universal interface that serves multiple functions: it provides RF signal transmission, mechanical mounting for the antenna module, electrical grounding, and structural support. By consolidating these multiple functions into a single component, the patent achieves antenna placement flexibility without proportionally increasing overall device complexity
Data Source
AI summary
An electronic device and a CIP (connector-in-package) package used therein. The CIP package can includes a semiconductor chip, an RF connector, and a carrier substrate. The carrier substrate is for carrying the semiconductor chip and the RF connector and electrically connected to the semiconductor chip and the RF connector to allow the semiconductor chip to transmit RF signal through the RF connector.