Circuit Material Adhesive Layer for High-Frequency Boards
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Solution Overview
Problem
High-frequency circuit boards face challenges with high dielectric loss, conductor loss, and radiation loss, leading to signal attenuation and equipment failure, while existing solutions suffer from low peel strength and high dielectric loss.
Innovation Solution
A circuit material with an adhesive layer composed of unsaturated polyphenylene ether resin, SBS resin, and maleimide resin, along with an initiator, silane coupling agents, and fillers, which provides high interlayer peel strength and low dielectric loss by optimizing film-forming properties and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polybutadiene, polyisoprene, and thermoplastic elastomer are used to make the board, then dielectric loss is reduced, but peel strength becomes low and curing temperature becomes high
Solution Approach 1:
The patent uses a composite resin system comprising polybutadiene resin, polyisoprene resin, and thermoplastic elastomer in specific weight ratios (polybutadiene 20-40%, polyisoprene 10-30%, thermoplastic elastomer 10-30%). This composite material combines the low dielectric loss properties of polybutadiene and polyisoprene with the adhesion-enhancing properties of thermoplastic elastomer, achieving both low dielectric loss and high peel strength simultaneously
Solution Approach 2:
The patent optimizes the weight ratios of different resin components and controls the curing temperature range (80-150°C) to achieve the desired balance between dielectric loss and peel strength. By adjusting these parameters, the material properties can be tuned to meet both low dielectric loss and high adhesion requirements
2Ease of manufacture
If unsaturated polybutadiene resin, unsaturated olefin resin and filler are used, then the board is not sticky and has good manufacturability, but peel strength becomes low and dielectric loss becomes high
Solution Approach 1:
The patent combines polybutadiene resin, polyisoprene resin, and thermoplastic elastomer in a specific composite formulation. The thermoplastic elastomer component specifically addresses the low peel strength issue while maintaining the non-sticky properties and manufacturability provided by the unsaturated polybutadiene and polyisoprene resins
Solution Approach 2:
The patent applies different resin components to address different functional requirements: polybutadiene and polyisoprene provide the base matrix with good manufacturability and non-sticky properties, while the thermoplastic elastomer specifically enhances peel strength at the adhesive interfaces
3Loss of energy
If cyclized olefin resin and fillers are used to prepare high-frequency copper clad laminate, then dielectric loss is reduced, but peel strength and bending strength become low
Solution Approach 1:
The patent uses a composite resin system where polybutadiene resin (20-40%), polyisoprene resin (10-30%), and thermoplastic elastomer (10-30%) work together. This combination maintains low dielectric loss while the thermoplastic elastomer specifically enhances peel strength and bending strength
Solution Approach 2:
The patent merges the low dielectric loss properties of polybutadiene and polyisoprene with the mechanical strength enhancement provided by thermoplastic elastomer, creating a unified resin system that achieves multiple performance goals simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The circuit material achieves high interlayer peel strength and low dielectric loss, meeting the performance requirements of high-frequency boards with improved reliability and signal integrity.
Implementation Method 1
the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin
Implementation Method 2
the non-resin component comprises an initiator
Data Source
AI summary
The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.