Circuit Apparatus with Variable Film Thickness Conductive Shield
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Solution Overview
Problem
The miniaturization and thinning of circuit apparatuses pose challenges in maintaining a uniform upper face height and effective electromagnetic noise shielding, especially when electronic components of varying heights are sealed with non-uniform sealing members, leading to instability and positional deviations during handling and mounting.
Innovation Solution
A circuit apparatus design featuring a wiring substrate with a conductive member that exposes the second surface of the sealing member, where the film thickness is continuously changed to compensate for height variations, providing a uniform upper face and effective shielding against electromagnetic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components of varying heights are sealed with non-uniform sealing members, then the circuit apparatus can accommodate different component heights, but the upper face becomes non-uniform causing handling instability and positional deviations
Solution Approach 1:
The conductive member is designed with non-uniform film thickness where the thickness varies locally to match the height variations of different electronic components. This local adaptation allows the upper face to remain uniform while accommodating components of different heights, resolving the contradiction between adaptability and stability.
2Object-affected harmful factors
If a shield is used to cover electronic components for electromagnetic noise prevention, then electromagnetic noise is blocked, but the device size increases
Solution Approach 1:
The conductive member integrates both the shielding function and the upper face formation function into a single structure. By merging these two functions, the patent eliminates the need for separate shielding components, thereby blocking electromagnetic noise without increasing device size.
Solution Approach 2:
The conductive member serves multiple functions simultaneously: it provides electromagnetic shielding, forms the upper face of the sealed structure, and compensates for height variations. This multi-functionality reduces the overall device volume while maintaining noise blocking capability.
3Volume of moving object
If the circuit apparatus is miniaturized and thinned, then the device size is reduced, but maintaining uniform upper face height and effective shielding becomes difficult
Solution Approach 1:
The film thickness parameter of the conductive member is varied continuously to compensate for height differences of underlying components. This parameter change allows the upper face to maintain uniform height even in miniaturized devices, resolving the contradiction between size reduction and manufacturing precision.
Data Source
AI summary
A circuit apparatus according to an embodiment includes: a wiring substrate having a wiring; a first electronic component provided on the wiring substrate; a second electronic component provided on the wiring substrate, the second electronic component having a height higher than a height of the first electronic component; a sealing member provided on the wiring substrate, the sealing member covering the first electronic component and the second electronic component, a first distance between a first surface of the sealing member above the first electronic component and the wiring substrate being shorter than a second distance between a second surface of the sealing member above the second electronic component and the wiring substrate; and a conductive member provided on the sealing member, the conductive member exposing the second surface, a third distance between a third surface of the conductive member provided above the first electronic component and the wiring substrate being equal to the second distance, and a film thickness of the conductive member at the third surface being thicker than a film thickness of the conductive member at a fourth surface provided between the third surface and the second surface.