Circuit Assembly Alignment Structure for Flexible Wiring
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Solution Overview
Problem
Current circuit assembly technologies, such as chip on glass bonding (COG), face challenges in reducing the number of flexible circuit boards and printed circuit board layers to minimize costs, particularly in designing peripheral layouts for source drivers due to limited flexibility and alignment precision issues, which restrict the use of wiring-on-array (WOA) on array substrates.
Innovation Solution
A structure for circuit assembly that utilizes a first and second alignment mark, along with a transmissive area, to enhance positional alignment precision between substrates, allowing for more flexible design and increased wiring area between driver chips, using conductive patterns, wiring, or ID marks for precise alignment checks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If alignment mark is positioned between two drivers to enable circuit assembly, then circuit assembly is enabled, but the space between drivers cannot be effectively utilized for constructing prospective wiring
Solution Approach 1:
The alignment structure is segmented into multiple components: a first alignment mark on the panel, a second alignment mark on the flexible circuit board, and a transmissive area that connects them. This segmentation allows each component to serve its specific function while enabling effective utilization of the space between drivers for wiring construction.
Solution Approach 2:
The invention introduces a transmissive area that creates a new spatial dimension for alignment verification. By adding this visual reference layer between the two alignment marks, the system enables wiring construction in the previously unused space between drivers without compromising circuit assembly capability.
2Measurement precision
If transmissive area is used for alignment check, then alignment precision is improved, but wiring design flexibility is restricted
Solution Approach 1:
The transmissive area is strategically positioned in a specific local region between the first and second alignment marks, allowing high-precision alignment verification in that localized area while leaving other regions free for flexible wiring design. This localizes the measurement function without globally restricting design freedom.
Solution Approach 2:
By introducing the transmissive area as an additional alignment reference dimension, the system achieves improved alignment precision without sacrificing wiring design flexibility in other areas. The multiple-dimensional alignment structure (first mark, second mark, and transmissive area) provides redundant verification without constraining the wiring space.
3Ease of manufacture
If alignment mark position is fixed by manufacturing tool limitations, then manufacturing compatibility is maintained, but space utilization between drivers is reduced
Solution Approach 1:
The alignment system is divided into multiple elements (first alignment mark, second alignment mark, transmissive area) that can be independently positioned. This segmentation allows the outer marks to maintain fixed positions for manufacturing compatibility while the transmissive area optimizes the utilization of the space between drivers for wiring construction.
Solution Approach 2:
The invention adds the transmissive area as an intermediate element that bridges the fixed alignment marks and the wiring space. This creates an additional functional layer that maintains manufacturing compatibility through fixed marks while effectively utilizing the inter-driver space for both alignment verification and wiring design.
Data Source
AI summary
A structure for circuit assembly is applied to positional alignment in bonding process. The structure for circuit assembly comprises a first substrate, having a plurality of first terminals and both a first alignment mark and a second alignment mark located in the vicinity of the first terminals, and a second substrate, having a plurality of second terminals and a transmissive area located in the vicinity of second terminals. During the first substrate bonding with the second substrate, as the edge of the transmissive area is located between the first alignment mark and the second alignment mark, and the first alignment mark is outside of the transmissive area, the first terminals are normally connected with the second terminals.