Circuit Assembly Busbar Adhesive Sheet Gap Protection
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Solution Overview
Problem
In circuit assemblies, the adhesive agent used to bond heat dissipation members can enter gaps between busbars and contact the electronic components, leading to potential connection failures due to thermal expansion or contraction, reducing the reliability of connections between terminals and busbars.
Innovation Solution
A circuit assembly design featuring an adhesive sheet with sheet openings that exposes busbars and lead terminals, covering the gap between busbars to prevent adhesive agent contact with electronic components, thereby confining the adhesive agent and reducing its influence on the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat discharging member is laminated on the circuit board to discharge heat, then heat dissipation performance is improved, but the adhesive agent may enter gaps between busbars and contact electronic components, reducing connection reliability
Solution Approach 1:
The adhesive sheet is segmented with sheet openings at positions corresponding to the busbars, allowing the adhesive agent to be applied in a segmented manner that prevents it from entering the gaps between busbars while still providing heat dissipation coverage in other areas
Solution Approach 2:
The adhesive sheet acts as an intermediary layer between the adhesive agent and the electronic components, controlling the flow path of the adhesive agent through its sheet openings to prevent direct contact with the gaps between busbars
2Strength
If the adhesive agent is applied to bond the heatsink to the busbars, then bonding strength is improved, but the adhesive agent may expand or contract due to thermal changes and push or draw the electronic component, causing connection failure
Solution Approach 1:
The adhesive sheet is segmented with sheet openings that allow controlled application of adhesive agent, preventing excessive adhesive from entering gaps and creating expansion/contraction forces that could damage connections
Solution Approach 2:
The adhesive sheet structure preliminarily prevents the adhesive agent from entering critical areas where thermal expansion or contraction could cause damage, countering potential connection failures before they occur
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances connection reliability by preventing adhesive agent contact with electronic components, even under thermal changes, thus maintaining stable connections between terminals and busbars.
Implementation Method 1
the adhesive sheet covering a gap between the plurality of busbars, the gap being located in the connection opening
Implementation Method 2
a heatsink that is laminated on a side of the plurality of busbars that is opposite to the circuit board via an adhesive agent
Implementation Method 3
a heatsink that is laminated on a side of the plurality of busbars that is opposite to the circuit board via an adhesive agent
Data Source
AI summary
Provided is a circuit assembly that includes a circuit board that has a connection opening, a plurality of busbars that are laminated on one surface side of the circuit board via an adhesive sheet, a coil that has a main portion and a plurality of lead terminals, the coil being arranged on the other surface side of the circuit board by the lead terminals being connected to the plurality of busbars that are exposed through the connection opening, and a heatsink that is laminated on a side of the plurality of busbars that is opposite to the circuit board via an adhesive agent. The adhesive sheet has sheet openings through which the plurality of busbars are exposed and the plurality of lead terminals are connected to the plurality of busbars, the adhesive sheet covering a gap between the plurality of busbars, the gap being located in the connection opening.