Circuit Assembly Busbar Through-Holes Adhesive Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In circuit assemblies for in-car electric components, heat-generated adhesive agents can expand or contract, causing connection failures between electronic components and busbars due to direct contact, leading to reduced reliability.
Innovation Solution
The circuit assembly incorporates substrate through-holes and busbar through-holes that are contiguous with sheet through-holes in the adhesive sheet, allowing the adhesive agent to escape into these holes rather than the gap between busbars, preventing direct contact with the electronic component and reducing thermal expansion effects on connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat discharging member is provided on the circuit board to discharge heat, then heat discharge performance is improved, but the adhesive agent may enter gaps between busbars and contact electronic components, causing connection failures
Solution Approach 1:
The invention divides the adhesive agent application area by introducing through-holes in the circuit board, adhesive sheet, and busbars. This segmentation creates separate zones: one for heat discharge (adhesive agent in through-holes) and one for electrical connection (busbar gaps remain clear of adhesive agent), resolving the contradiction between heat discharge and connection reliability
Solution Approach 2:
The through-holes act as intermediary spaces that redirect the adhesive agent away from the critical gap between busbars and electronic components. The adhesive agent is channeled into the through-holes instead of accumulating in harmful positions, maintaining both heat discharge function and connection integrity
2Strength
If the adhesive agent is used to bond the heatsink to busbars, then bonding strength is improved, but thermal expansion and contraction of the adhesive agent can push or draw the electronic component, causing connection failure
Solution Approach 1:
The bonding function is segmented between two locations: strong bonding occurs through adhesive agent in the through-holes (providing anchoring strength), while the gap between busbars remains free of adhesive to prevent mechanical interference with electronic components during thermal cycling
Solution Approach 2:
The harmful effect of adhesive agent thermal expansion is extracted by removing the adhesive agent from the gap between busbars and electronic components. The adhesive is relocated to through-holes where its expansion does not interfere with component connections, maintaining bonding strength without compromising reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances connection reliability by minimizing the adhesive agent's impact on thermal expansion and contraction, maintaining stable connections between lead terminals and busbars.
Implementation Method 1
the adhesive agent 135 expands due to the heat generated by the circuit board 112 or the electronic component 115
Implementation Method 2
a heatsink that is laid, via an adhesive agent, on surfaces of the plurality of busbars that face away from the circuit board
Data Source
AI summary
Provided is a circuit assembly that includes: a circuit board that has a connection opening; a plurality of busbars that are laid on one surface side of the circuit board; a coil that includes a main portion and a plurality of lead terminals, the lead terminals being connected to the plurality of busbars exposed through the connection opening; and a heatsink that is laid, via an adhesive agent, on surfaces of the plurality of busbars that face away from the circuit board. The circuit board is provided with a substrate through-hole in the vicinity of the connection opening, and the plurality of busbars are provided with a busbar through-hole at the position that corresponds to the substrate through-hole.