Circuit Assembly Carrier Element Mechanical Load Absorption
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Solution Overview
Problem
Existing circuit arrangements face mechanical stress issues during manufacturing and operation, leading to component breakage and disruptions, especially in compact power modules with high switching frequencies, as mechanical loads are not effectively absorbed or reduced, causing damage to electrical and electronic components.
Innovation Solution
A circuit arrangement featuring a carrier element that absorbs mechanical loads before they reach the components, connected indirectly to the circuit carrier, providing greater strength and protection, allowing for a compact and cost-effective design with reduced error rates and increased operational reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electrical and electronic components are arranged directly on the circuit carrier, then the device complexity is reduced and ease of manufacture is improved, but mechanical strength and reliability deteriorate due to direct transmission of mechanical loads causing component breakage
Solution Approach 1:
A carrier element is introduced as an intermediary component between the circuit carrier and the electrical/electronic components. This carrier element absorbs mechanical loads before they reach the components, preventing direct transmission of stresses while maintaining structural support and electrical connection functions.
Solution Approach 2:
The carrier element is designed with mechanical strength greater than both the circuit carrier and the components to absorb and cushion mechanical loads before they can cause damage. This protective function is built into the structure beforehand, preventing component breakage during assembly and operation.
2Area of stationary object
If components are arranged compactly on the circuit carrier, then the area occupied is reduced and productivity is improved, but mechanical strength deteriorates as mechanical stresses cannot be absorbed and directly act on components causing breakage
Solution Approach 1:
The carrier element serves as a protective intermediary that enables compact component arrangement while maintaining mechanical strength. It absorbs mechanical stresses that would otherwise directly affect components, allowing dense packaging without compromising reliability.
Solution Approach 2:
The solution employs a composite structure combining the circuit carrier, the mechanically stronger carrier element, and the electronic components. This multi-layer composite design distributes mechanical loads across different materials with complementary properties, enabling both compactness and strength.
3Reliability
If a carrier element with greater mechanical strength is introduced, then reliability and fracture load are improved by up to five times, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The carrier element is designed to perform multiple functions simultaneously: providing mechanical support, absorbing loads, enabling electrical connections, and facilitating heat dissipation. This multi-functionality justifies the added structural element by consolidating several requirements into a single component.
Solution Approach 2:
The carrier element's enhanced mechanical strength is built into the design beforehand to prevent component failure. By absorbing mechanical loads in advance, it eliminates the need for more complex protective mechanisms or larger safety margins in component selection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a carrier element with greater mechanical strength than the components absorbs loads, increasing the fracture load by up to five times, protecting components and enabling more compact and reliable circuit designs.
Implementation Method 1
the at least one carrier element is connected to the at least one circuit carrier in such a way that at least part of a mechanical load acting on the circuit carrier is first transferred to the at least one carrier element
Data Source
Figure 1a~1b
Figure 2.1~2.2
Figure 2.3~2.4
AI summary
The invention relates to a circuit arrangement comprising at least one circuit carrier with at least one conductor structure formed on the circuit carrier. The conductor structure has at least one first and one second electrical contact point. The circuit arrangement further comprises at least one electrical and/or electronic component with at least one first and one second connection area. To form a circuit, the at least first contact point of the conductor structure is directly or indirectly electrically connected to the at least first electrical connection area of the electrical and/or electronic component, and/or the at least second contact point of the conductor structure is directly or indirectly connected to the at least second connection area of the electrical and/or electronic component.The at least one electrical and/or electronic component is arranged on at least one support element to reduce the transmission of mechanical loads from the at least one circuit carrier and is indirectly connected to the circuit carrier via the at least one support element. This connection is made by linking the at least one support element to the circuit carrier.