Circuit Assembly Cooling with Flexible Hose Thermal Contact
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Solution Overview
Problem
Existing electronic devices face challenges in effectively dissipating heat from semiconductor components, particularly when installed in housings with guide rails, as applying sufficient force for intimate thermal contact is difficult without risking damage to components.
Innovation Solution
A circuit arrangement with a thermally conductive plate and cooling element, featuring recesses to accommodate a flexible hose, allows for enhanced heat dissipation by using a cooling liquid to press the hose against the recess walls, ensuring secure thermal contact without damaging components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive plate is pressed against a cooling element to ensure intimate thermal contact, then heat dissipation efficiency is improved, but the risk of damaging semiconductor components and connections increases
Solution Approach 1:
The patent employs a flexible hose instead of rigid mechanical pressing to achieve intimate thermal contact between the thermally conductive plate and cooling element. The flexible hose can be pressed against the plate's connecting surface by cooling medium pressure, ensuring good thermal contact without transmitting excessive force to the semiconductor components.
Solution Approach 2:
The patent uses cooling medium pressure (hydraulic principle) to press the flexible hose against the thermally conductive plate. This allows controlled application of force through fluid pressure rather than direct mechanical compression, achieving the needed thermal contact while protecting components from damage.
2Temperature
If high force is applied to press components together for optimal thermal contact, then thermal coupling is improved, but the tolerance for assembly misalignment decreases
Solution Approach 1:
The flexible hose acts as a compliant element that can deform to accommodate assembly tolerances and misalignments. Instead of requiring precise alignment under high force, the flexible hose naturally conforms to the surface irregularities and gaps, maintaining good thermal contact even with moderate assembly precision.
Solution Approach 2:
The patent changes the physical state of the coupling medium from rigid (direct metal-to-metal contact) to flexible (hose filled with cooling medium). This parameter change allows the system to accommodate larger dimensional variations and misalignments while maintaining effective thermal coupling.
3Temperature
If a rigid cooling element structure is used to ensure stable thermal contact, then thermal conductivity is improved, but adaptability to different installation configurations decreases
Solution Approach 1:
The flexible hose provides adaptability in installation configurations while maintaining effective thermal contact. It can be routed through guide rails and adapted to different spatial arrangements, unlike rigid cooling elements that require precise alignment and fixed mounting positions.
Solution Approach 2:
The system transitions from a static, rigid cooling element arrangement to a dynamic, flexible hose configuration that can adapt its shape and position. This allows the cooling system to accommodate various installation scenarios and maintain thermal contact under different mechanical conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient heat transfer from the thermally conductive plate to the cooling element, even in housings with guide rails, by utilizing the pressure of a cooling fluid to maintain contact and fix the components securely, allowing for effective heat dissipation.
Implementation Method 1
the pressure of a cooling fluid to maintain contact and fix the components securely
Implementation Method 2
a thermally conductive plate which serves as a heat sink, is in thermally conductive contact with the at least one semiconductor component
Data Source
AI summary
An electronic device comprises a circuit arrangement having a circuit board with a heat-generating semiconductor component, and a thermally conductive plate as a heat sink configured to be in thermally conductive contact with a cooling element. A recess provided in the thermally conductive plate in the region of a connecting surface, for connecting to the cooling element, is configured to receive a part of a flexible hose. A housing with at least two receiving rails for receiving the circuit arrangement, is formed with a cooling element arranged between the two receiving rails such that contact is made between the connecting surface of the thermally conductive plate and the cooling element when the circuit arrangement is fully inserted into the housing between the receiving rails, wherein the cooling element has, in the region of a connecting surface, a recess in which at least a part of the flexible hose is arranged.