Circuit Assembly Heat Capacity Boost at Relay Connection Points

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Solution Overview

Problem

Existing heat dissipating structures in circuit assemblies with heat generating components, such as relays, fail to quickly reduce heat generation at connection portions when large currents flow.

Innovation Solution

A circuit assembly with a heat capacity increasing component thermally connected to the connection portion of a heat generating component, fastened by a fastening member, and optionally including a heat conducting member to dissipate heat via a case.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat dissipating structure is provided in the intermediate portion of the bus bar, then heat dissipation of the relay is promoted, but heat generation at the connection portion cannot be quickly reduced when large current flows

Engineering Contradiction:

Improveheat dissipation of relayVSAvoidtime to reduce heat at connection portion

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

The heat dissipation function is segmented into two distinct locations: the intermediate portion of the bus bar and the connection portion of the relay. This allows each location to be optimized independently for its specific heat dissipation needs.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A heat capacity increasing component is introduced as an intermediary element at the connection portion. This component acts as a thermal mediator that rapidly absorbs and transfers heat away from the connection portion, enabling quick heat reduction without affecting the overall relay heat dissipation system.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If the heat capacity of the connection portion is increased, then heat generation is quickly reduced, but the device complexity increases

Engineering Contradiction:

Improveheat generation reduction speedVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat capacity of the connection portion is changed by adding a component with high heat capacity characteristics. This parameter change enables the connection portion to rapidly absorb and dissipate heat generated during high current flow, solving the heat reduction speed issue without requiring complex active cooling systems.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Quickly reduces heat generation at connection portions by increasing the heat capacity of the connection area, thereby enhancing heat dissipation efficiency.

Implementation Method 1

a heat capacity increasing component that thermally connects to a fastening site of the energization member and the connection portion and increases a heat capacity of the connection portion

Methodology Applied

Scientific EffectHeat capacity: Thermal Energy Storage

Implementation Method 2

a heat capacity increasing component that thermally connects to a fastening site of the energization member and the connection portion

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250287542A1Circuit assembly

Publication Date: 2025.09.11 AUTONETWORKS TECH LTD

AI summary

A circuit assembly includes a heat generating component that generates heat when energized; a energization member that connects to a connection portion of the heat generating component; a fastening member that fastens the energization member to the connection portion; and a heat capacity increasing component that thermally connects to a fastening site of the energization member and the connection portion and increases a heat capacity of the connection portion of the heat generating component.