Circuit Assembly Level Difference Reduction
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Solution Overview
Problem
The existing electrical junction boxes face increased operation steps and production costs due to level differences between conductive patterns on control circuit boards and exposed busbars, requiring complex component configurations and bending of lead terminals.
Innovation Solution
A circuit assembly design featuring a first insulating board with conductive paths and insertion holes, a busbar, and a second insulating board overlapping the first board and busbar, with the second board's conductive paths electrically connecting to the busbar, reducing level differences and simplifying component connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional electrical junction box uses a control circuit board with a busbar adhered to the rear side, then the electrical connection function is achieved, but a level difference is formed between the conductive pattern on the front surface and the exposed busbar, requiring bending of lead terminals or additional relay members
Solution Approach 1:
The invention introduces a second board positioned at the same level as the busbar, creating a new dimensional layer that bridges the height difference between the front surface conductive pattern and the exposed busbar. This allows electronic component terminals to connect to the second board's conductive pattern without bending, while the second board's conductive pattern connects to the busbar through the same level interface, effectively resolving the level difference problem through spatial dimensionality.
Solution Approach 2:
The second board acts as an intermediary element between the first board's conductive pattern and the busbar. It provides a conductive pattern at the same level as the busbar, serving as a mediation interface that eliminates the need for lead terminal bending or additional relay members, thereby simplifying the connection structure while maintaining electrical connectivity.
2Ease of operation
If lead terminals are bent to accommodate the level difference, then connection is achieved, but the number of operation steps increases
Solution Approach 1:
By positioning the second board at the same level as the busbar, the invention creates a flat connection surface that eliminates the need for lead terminal bending operations. Electronic component terminals can be directly connected to the conductive pattern on the second board's front surface, significantly reducing assembly operation steps and time while maintaining proper electrical connection.
3Ease of manufacture
If relay members with thickness corresponding to the level difference are prepared, then connection is achieved, but production cost increases due to an increase in the number of components
Solution Approach 1:
The invention merges the functions of the first board, busbar, and connection interface into an integrated structure where the second board is positioned at the same level as the busbar. This eliminates the need for separate relay members with thickness corresponding to the level difference, reducing the total number of components while maintaining the electrical connection function.
Solution Approach 2:
The second board serves multiple functions: it provides a conductive pattern at the same level as the busbar for direct terminal connection, acts as a structural support, and facilitates electrical connection between the first board and busbar. This multi-functionality eliminates the need for additional relay members, reducing component quantity while maintaining connection ease.
Data Source
AI summary
A circuit assembly includes an electronic component including a plurality of terminals, a first board that is constituted by an insulating plate provided with a conductive path and an insertion hole into which the electronic component is inserted, a busbar that overlaps the first board, and a second board that is constituted by an insulating plate provided with a conductive path and overlapping the first board, at least a portion of the second board being arranged on the same level as the busbar. The plurality of terminals of the electronic component is connected to the busbar and the conductive path of the second board.