Circuit Assembly Heat Dissipation via Movable Thermal Conductor
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Solution Overview
Problem
Conventional heat dissipation techniques for electronic components mounted on substrates face challenges in modifying the busbar path, leading to difficulties in improving heat dissipation due to constraints on the integration of heat dissipation members, resulting in reduced thermal conductivity and efficiency.
Innovation Solution
A circuit assembly design that includes a heat generation component, a base member with a through hole, a heat dissipation member, and a busbar connected to the component at a position spaced apart from the base, with a movable heat transfer member inserted into the through hole to absorb dimensional accuracy errors and enhance contact with the busbar and heat dissipation member, allowing for elastic deformation and increased contact area for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the busbar is integrated with the heat dissipation member as one piece with the heat conduction sheet, then the structure is simplified and manufacturing is easier, but the busbar shape cannot be modified to improve heat dissipation
Solution Approach 1:
The patent divides the integrated structure into separate components: the busbar and the heat dissipation member are no longer integrated but are positioned at spaced-apart locations. This segmentation allows independent optimization of each component - the busbar can be shaped for electrical connectivity while the heat dissipation member can be designed for thermal management, resolving the contradiction between manufacturing simplicity and design flexibility.
2Stability of the object's composition
If the heat transfer member is fixed to the base member, then the structure is stable, but dimensional accuracy errors cause poor contact or excessive pressure reducing thermal conductivity
Solution Approach 1:
The heat transfer member is made movable within the through hole rather than being fixed, allowing it to dynamically adjust its position. This dynamic capability enables the system to compensate for dimensional variations in the base member, busbar, and heat transfer member themselves, ensuring optimal contact pressure and thermal conductivity despite manufacturing tolerances.
Solution Approach 2:
The patent changes the state of the heat transfer member from fixed to movable, allowing positional parameter adjustment. This parameter change enables the heat transfer member to adapt to dimensional variations, maintaining stable thermal contact without requiring high manufacturing precision.
3Reliability
If the busbar is connected to the terminal at a position spaced apart from the base member, then the busbar shape can be modified to increase contact area, but the structure becomes more complex
Solution Approach 1:
The patent utilizes the spatial dimension by positioning the busbar connection point at a location spaced apart from the base member. This dimensional arrangement allows the busbar to extend and increase its contact area with the heat transfer member without adding structural complexity, as the spacing provides natural room for the busbar to reach and contact the heat transfer member effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for enhanced heat dissipation by increasing the contact area between the busbar and heat transfer member, suppressing reductions in thermal conductivity due to dimensional accuracy errors, and enabling flexible modification of the busbar shape for improved heat dissipation performance.
Implementation Method 1
the heat of the heat generation component can be dissipated to the outside from the heat dissipation member via the busbar and the heat transfer member
Implementation Method 2
the heat transfer member is inserted into the through hole so as to be movable in a direction along the axial direction of the through hole
Data Source
AI summary
The heat dissipation of a circuit assembly is improved. A circuit assembly includes: a relay that includes a terminal and generates heat when energized/as a result of energization/due to being energized; a base member to which the relay is attached and in which a through hole is formed; a heat dissipation member that is provided on a side of the base member opposite to a side on which the relay is attached; a first busbar that is connected to the terminal of the relay at a position spaced apart from the base member; and a heat transfer member that is inserted into the through hole so as to be movable in a direction along the axial direction of the through hole, and that comes into contact with the first busbar and the heat dissipation member.