Insulated Circuit Assembly Sealing for Heat Dissipation and Waterproofing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Circuit assemblies with heat-generating components face issues of condensation due to temperature differences, leading to water accumulation that compromises insulation and waterproofness, potentially causing short circuits.
Innovation Solution
A circuit assembly design featuring a heat-dissipating metal plate exposed through a case opening sealed by an insulating film, ensuring insulation and waterproofness by preventing water entry from condensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat-dissipating portion is exposed to the outside through an opening portion in the case, then heat dissipation efficiency is improved, but waterproofness and insulation are compromised due to condensation and water entry
Solution Approach 1:
An insulating film is introduced as an intermediary element that seals the opening portion of the case. This film allows thermal contact between the heat-dissipating portion and the external heat-dissipation target while preventing water entry and maintaining insulation. The insulating film acts as a mediator that reconciles the conflicting requirements of heat dissipation and waterproofing.
Solution Approach 2:
The patent employs a thin insulating film to seal the opening portion. This thin film structure maintains thermal conductivity for heat dissipation while providing a barrier against water and condensation. The flexible nature of the film allows it to conform to the opening while maintaining the seal integrity.
2Reliability
If the opening portion is sealed to prevent water entry, then waterproofness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
A thin insulating film is used to seal the opening portion. The film's thinness allows it to maintain thermal conductivity for effective heat dissipation while providing sufficient barrier properties to prevent water entry and condensation accumulation.
Solution Approach 2:
The insulating film is positioned between the heat-dissipating portion and the external environment, creating a composite structure that combines insulation properties (waterproofing) with thermal contact properties (heat dissipation). This composite arrangement resolves the contradiction between sealing and heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design maintains insulation and waterproofness by inhibiting water entry, preventing short circuits and ensuring effective heat dissipation.
Implementation Method 1
a heat-dissipating portion configured to come into thermal contact with an external heat-dissipation target
Implementation Method 2
the temperature difference between the circuit assembly and the housing may cause condensation around the case
Data Source
AI summary
Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a result of a current flowing therethrough; metal plates connected to connecting portions of the heat-generating components, and each having a heat-dissipating portion configured to come into thermal contact with an external heat-dissipation target; a case accommodating the heat-generating components and the metal plates, and having opening portions that expose the heat-dissipating portions of the metal plates to an outside; and an insulating film sealing the opening portions of the case and fixed to the case.