Circuit Assembly Terminal Height Equalization
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Solution Overview
Problem
Circuit assemblies face challenges in connecting electronic components with different terminal heights to substrates, often requiring terminal bending, which can compromise reliability and efficiency.
Innovation Solution
A circuit assembly design where an electronic component with protruding terminals is mounted on a substrate with strategically placed openings and connection portions, allowing for equal terminal heights and improved connection reliability without terminal bending, using a conductive member connected through openings and potentially through-holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive pattern and conductive member have different heights, then the electronic component can be mounted on the substrate, but terminal bending is required which compromises reliability
Solution Approach 1:
The patent introduces a mounting structure comprising a mounting surface and a conductive member that acts as an intermediary between the substrate and the electronic component. The mounting surface provides a reference plane at a first height, while the conductive member extends to a second height, creating a height difference that eliminates the need for terminal bending. This intermediary structure absorbs the height discrepancy and enables direct SMD mounting of the electronic component.
Solution Approach 2:
The patent resolves the height mismatch problem by transitioning from a two-dimensional plane to a three-dimensional structure. The mounting surface and conductive member create multiple height levels (first height and second height), allowing the electronic component to be mounted on the mounting surface while its terminals connect to the conductive member at a different height level, eliminating the need for terminal deformation.
2Reliability
If the conductive member is added to resolve height differences, then terminal bending is eliminated, but the device structure becomes more complex
Solution Approach 1:
The conductive member serves multiple functions simultaneously: it provides electrical connection, establishes height reference, and enables mechanical mounting. By integrating these functions into a single structure, the patent avoids adding separate components for each function, thereby reducing overall structural complexity while achieving the desired reliability improvement.
Solution Approach 2:
The patent merges the mounting function and electrical connection function into a single integrated structure. The mounting surface and conductive member work together as a unified mounting structure that both mechanically supports the electronic component and provides electrical pathways, eliminating the need for separate mounting elements and reducing structural complexity.
Data Source
AI summary
Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.