Circuit Assembly Layout for Small Terminal Spacing
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Solution Overview
Problem
Conventional circuit assemblies restrict the mounting of electronic components with terminal distances smaller than a predetermined value due to the requirement for a specific distance between busbars and control terminals, limiting their versatility.
Innovation Solution
The circuit assembly includes conductive members with exposed surfaces, an insulating holding member, and conductive films that electrically connect the terminals, allowing for flexible positioning and mounting of components with smaller terminal distances by covering parts of the insulating portion and exposed surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the distance between busbars and control terminals is increased to allow molten resin entry during insert molding, then the molding process is enabled, but electronic components with smaller terminal distances cannot be mounted, reducing versatility
Solution Approach 1:
The conductive members are segmented into exposed surfaces and embedded portions. The exposed surfaces are positioned closer together than the embedded busbars and control terminals, allowing electronic components with smaller terminal distances to be mounted while the embedded portions maintain the larger distance needed for resin entry during insert molding
Solution Approach 2:
The solution transitions from a two-dimensional planar arrangement to a three-dimensional configuration where conductive members have both exposed surfaces (for component mounting) and embedded portions (for structural support and resin entry). This vertical dimensionality allows different distance requirements to be satisfied simultaneously at different levels
2Adaptability or versatility
If the distance between busbars and control terminals is reduced to match smaller terminal distances of electronic components, then versatility is improved, but molten resin cannot enter the space between busbar and control terminal during insert molding
Solution Approach 1:
The conductive members are divided into exposed surfaces positioned close together (for component mounting) and embedded portions positioned farther apart (for resin entry). This segmentation allows the mounting distance and molding distance to be independently optimized
Solution Approach 2:
The holding member acts as an intermediary that supports the embedded portions of the conductive members at appropriate distances apart, allowing molten resin to enter the space between them during insert molding, while the exposed surfaces extend closer together to accommodate electronic components with smaller terminal distances
Data Source
AI summary
A circuit assembly includes: a first conductive member; a second conductive member; a holding member that is insulating and holds the first conductive member and the second conductive member; and an electronic component that includes a first terminal and a second terminal. The first conductive member has a first exposed surface exposed from the holding member so as to be electrically connected to the first terminal, the second conductive member has a second exposed surface exposed from the holding member so as to be electrically connected to the second terminal, the holding member includes an insulating portion located between the first exposed surface and the second exposed surface, a first conductive film is provided, the first conductive film covering at least a part of the first exposed surface and part of the insulating portion, and the first terminal is electrically connected to the first conductive film.