3D Shape Measurement of Circuit Boards via Illumination Standardization

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional 3D shape measurement methods are inefficient when measuring new objects, as they require manual calculation of measuring conditions, leading to operator fatigue and reduced productivity in electronic circuit board manufacturing.

Innovation Solution

A method that measures the brightness of an illumination source and phase-to-height conversion factor, allowing for standardized illumination and automatic selection between normal and teaching-based inspection modes, with database search for bare board information to improve measurement quality and productivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If manual calculation of measuring conditions is performed for each new object, then measurement accuracy can be maintained, but operator fatigue increases and productivity decreases

Engineering Contradiction:
Improvemeasurement accuracyVSAvoidproductivity
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The system performs self-measurement by automatically calculating measuring conditions for new objects using the measurement information storage unit. The computer automatically determines phase-to-height conversion factors and illumination parameters without human intervention, allowing the system to serve itself rather than requiring operator input for each new object type.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The system creates a digital copy of measurement conditions by storing measured data in the measurement information storage unit. Once measuring conditions are calculated for a new object type, they are saved and can be reused for identical objects in future measurements, eliminating the need to recalculate the same parameters repeatedly.

Inventive Principle:
Principle #26Copying

2Measurement precision

If standardized illumination brightness is implemented, then measurement quality improves, but additional brightness measurement and control steps are required

Engineering Contradiction:
Improvemeasurement qualityVSAvoidprocess complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The system performs preliminary brightness measurement and standardization by measuring the actual brightness of the illumination source before conducting the main 3D shape measurement. This preliminary action ensures that illumination conditions are optimal and standardized, improving measurement quality while automating the process to prevent operator fatigue.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances measurement quality and productivity by standardizing illumination and automating inspection modes, enabling efficient 3D shape measurement of circuit boards with improved accuracy and reduced operator effort.

Implementation Method 1

measuring a brightness of a first illumination source

Methodology Applied
Scientific EffectBrightness measurement:

Implementation Method 2

measuring a 3D shape of a circuit board... by controlling... a brightness of a first illumination source

Methodology Applied
Scientific EffectIllumination: Light

Implementation Method 3

measuring a phase-to-height conversion factor... to measure a 3D shape

Methodology Applied
Scientific EffectPhase measurement:

Data Source

PatentUS7545512B2Method for automated measurement of three-dimensional shape of circuit boards
Publication Date: 2009.06.09 KOHYOUNG TECH
  • US7545512B2 patent drawing
  • US7545512B2 patent drawing
  • US7545512B2 patent drawing

AI summary

A method of measuring a 3D shape includes the steps of measuring a brightness of a first illumination source 41a, measuring a phase-to-height conversion factor, measuring a 3D shape of a circuit board 62 according to the normal inspection mode, and determining whether bare board information about the circuit board 62 is included. If the information is not included, performing bare board teaching to acquire the information. Then, the 3D shape of target objects on the circuit board 62 are measured, when the bare board information is included or bare board teaching information is generated. Next, the circuit board 62 is analyzed to determine if it is normal or abnormal by using 3D shape information.