Continuous Sheet for Circuit Board Production via Adhesion Substrate
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Solution Overview
Problem
Existing methods for manufacturing copper clad laminates (CCLs) for circuit board production are either non-continuous, reducing productivity, or require expensive belt presses for reel-type production.
Innovation Solution
A roll-to-roll continuous process is developed by connecting sheet type metal laminates using a conductive adhesion substrate, allowing for the production of a continuous sheet for circuit board production without the need for a belt press.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sheet type CCL manufacturing method is used, then basic mechanical properties are achieved, but productivity is lowered due to non-continuous process
Solution Approach 1:
The patent applies continuity of useful action by transforming the traditional sheet-type batch manufacturing process into a continuous roll-to-roll manufacturing process. Multiple sheet-type metal laminates are connected in series through adhesion substrates, enabling continuous production without stopping for intermediate processing steps, thus achieving both high productivity and automated continuous operation.
2Productivity
If belt press is installed for reel type CCL production, then continuous production is achieved, but initial investment cost becomes high
Solution Approach 1:
The patent introduces adhesion substrates as intermediary elements that connect multiple sheet-type metal laminates. These adhesion substrates serve as mediators that enable continuous roll-to-roll production by bonding sheets together, replacing the need for expensive belt press equipment while maintaining continuous manufacturing capability and reducing initial investment costs.
Solution Approach 2:
The patent employs inexpensive adhesion substrates that can be easily applied and removed, replacing costly belt press equipment. These disposable or consumable adhesion layers provide the necessary bonding function at minimal cost, enabling continuous production without requiring expensive capital equipment investment.
3Strength
If adhesion substrate is wound around adjoined sheet type metal laminates, then mechanical properties and chemical resistance are improved, but process complexity increases
Solution Approach 1:
The patent merges multiple functions into the adhesion substrate: it provides mechanical bonding between sheets, enhances chemical resistance, and enables continuous roll-to-roll processing. By combining these functions into a single component, the overall process complexity is managed while achieving improved mechanical properties and chemical resistance.
Data Source
AI summary
The present disclosure relates to a manufacturing method of a continuous sheet for circuit board production providing reel type laminates in a roll-to-roll continuous process without a belt press by connecting at least two or more sheet type metal laminates using an adhesion substrate which includes a reinforcement film and a conductor, the manufacturing method providing improved mechanical properties, and excellent chemical resistance and productivity, and the continuous sheet for circuit board production manufactured therefrom.