Aerosol Provision Pressure Sensing With Circuit-Board Airflow Paths
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Solution Overview
Problem
Existing aerosol provision systems face manufacturing challenges due to the complexity of integrating air flow and pressure sensors with circuit boards, requiring bulky seals and design constraints that complicate the system's fluid communication and manufacturing process.
Innovation Solution
An aerosol provision system with a circuit board featuring a hole to facilitate fluid communication between the air flow and pressure sensors and the mouthpiece, allowing the seal to be placed on the opposite side of the board, reducing the need for larger seals and simplifying the internal design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the air flow sensor and pressure sensor are integrated with the circuit board using traditional methods, then the system can achieve accurate sensing, but the manufacturing process becomes complex and requires bulky seals
Solution Approach 1:
The patent merges the air flow sensor and pressure sensor directly with the circuit board by mounting them on the board surface and using the board itself as the sealing structure. The circuit board's rigid structure eliminates the need for separate bulky seals, while the direct mounting ensures accurate sensing. This integration simplifies manufacturing by reducing the number of separate components and assembly steps.
Solution Approach 2:
The circuit board serves multiple functions: it provides electrical connections for the sensors, acts as the sealing structure to contain airflow and pressure, and serves as the mounting surface for the sensors. This multi-functionality eliminates the need for separate sealing components and simplifies the overall system design, making manufacturing easier while maintaining measurement accuracy.
2Reliability
If traditional sealing methods are used to connect sensors with the circuit board, then fluid communication can be achieved, but the seal size increases and space occupation increases
Solution Approach 1:
The patent combines the sealing function with the circuit board structure itself. The rigid circuit board provides the seal that contains airflow and pressure, eliminating the need for separate sealing components. This integration maintains reliable fluid communication while significantly reducing the space required for sealing structures.
Solution Approach 2:
The circuit board provides localized sealing at the sensor mounting areas, where the rigid board structure creates tight seals around the sensor connections. This localized approach ensures reliable fluid communication only where needed, rather than requiring bulky seals throughout the entire device, thereby reducing overall space occupation.
3Reliability
If the seal is placed on the same side as the sensor mounting, then fluid communication is achieved, but the internal design becomes constrained and bulky
Solution Approach 1:
Instead of placing the seal on the same side as the sensor mounting, the patent uses the circuit board's rigid structure to provide sealing at the sensor connections, effectively inverting the traditional approach. The seal is integrated into the board structure itself, allowing fluid communication without constraining the internal design or increasing bulkiness.
Solution Approach 2:
The circuit board serves as both the electrical connection medium and the sealing structure. This multi-functionality allows fluid communication to be achieved without adding separate sealing components that would constrain the internal design. The board's rigid structure provides the necessary seals at the sensor mounting areas, freeing up internal space for other components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement simplifies the manufacturing process and provides flexibility in component arrangement, enabling accurate airflow and pressure measurement while reducing bulkiness and space occupation within the system.
Implementation Method 1
an air flow sensor and/or a pressure sensor... to provide the fluid communication to the first side or the second side
Implementation Method 2
an air flow sensor and/or a pressure sensor... in fluid communication with ambient air
Data Source
AI summary
An aerosol provision system has a pressure sensing apparatus including a circuit board and a pressure sensor. A first side of the pressure sensor is in fluid communication with a mouthpiece of the aerosol provision system and a second side of the pressure sensor is in fluid communication with ambient air. The pressure sensor is mounted on the circuit board to provide the fluid communication to the first side or the second side. The circuit board has a hole to provide the fluid communication to the other of the first side and the second side of the pressure sensor.