Circuit Board Cover With Airflow and Electromagnetic Shielding
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Solution Overview
Problem
Existing image forming apparatuses face challenges in protecting electronic components from excessive voltage or current while maintaining a compact design, as covering these components with traditional methods increases cost and risks overheating, leading to malfunction and reduced component life.
Innovation Solution
An electrical circuit design featuring a cover with an opening and a shielding member that forms an air stream path to dissipate heat and protect electronic components, reducing the need for additional covers and minimizing space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic component is covered with a cover, then the electronic component is protected from damage, but the electronic component becomes hot without being cooled with surrounding air, causing malfunction and reduction in component life
Solution Approach 1:
The cover is designed with differentiated regions: a first region that contacts the circuit board for structural support and protection, and a second region that is separated from the circuit board to create an air gap. This local differentiation allows the cover to provide protection while maintaining thermal management through natural convection cooling in the gap region.
2Reliability
If the circuit board itself is covered with the box-shaped component, then the electronic component is protected, but the cost of components is increased and a space required at the time of mounting is also increased
Solution Approach 1:
The cover is integrated directly with the circuit board structure, eliminating the need for separate box-shaped protective components. The cover serves multiple functions: protecting the electronic component, maintaining structural integrity, and enabling thermal management through its design with air gaps, thereby reducing overall device complexity and cost.
3Reliability
If the electronic component is covered with a cover, then the electronic component is protected from damage, but the space required for mounting the circuit board is increased
Solution Approach 1:
The cover utilizes the vertical dimension by creating an air gap between the second region of the cover and the circuit board surface. This three-dimensional configuration allows protection without increasing the horizontal mounting footprint, as the protective function is achieved through vertical separation rather than horizontal expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prolongs the life of electronic components by preventing damage and overheating, while allowing for a more compact and cost-effective arrangement of circuit boards in image forming apparatuses.
Implementation Method 1
a path of an air stream is formed, the path communicating from an outside of the cover to the electronic component in the accommodating space through the opening
Implementation Method 2
the cover includes a shielding member arranged between the opening and the electronic component in the accommodating space
Data Source
AI summary
An electrical circuit includes an electronic component, a circuit board having a first surface on which the electronic component is arranged, and a cover provided on the first surface and configured to form an accommodating space where the electronic component is accommodated, the cover including a first part and a second part, wherein the first part of the cover is in contact with the first surface of the circuit board, wherein an opening is formed between the second part of the cover and the first surface of the circuit board, wherein a path of an air stream is formed, the path communicating from an outside of the cover to the electronic component in the accommodating space through the opening, and wherein the cover includes a shielding member arranged between the opening and the electronic component in the accommodating space.