Circuit Board Analysis Method for Solder Bond Integrity

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Solution Overview

Problem

Existing methods for analyzing circuit boards fail to effectively identify and diagnose defects in solder connections and integrated circuit packages during assembly, limiting the ability to prevent failures and improve quality control.

Innovation Solution

A method involving partial removal of the circuit board, dye mapping, and analysis of the integrated circuit package to assess bond integrity and potential delamination, including milling the board to reduce thickness and applying a protective coating for peeling without damaging the die or substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If testing operations are performed on the circuit board, then the circuit board can be evaluated for functionality, but the testing operations may impact and damage components of the circuit board, limiting the ability to evaluate assembly processes

Engineering Contradiction:

Improvecircuit board functionalityVSAvoidcomponent damage from testing

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The analysis process is segmented into distinct phases: first evaluating the circuit board assembly with components intact, then separating the circuit board from the integrated circuit package for individual analysis. This allows functional testing to be performed on the assembly while damage-free evaluation of components is performed separately after disassembly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The circuit board is evaluated for functionality before disassembly operations are performed. This preliminary functional assessment allows testing to be completed while components are still in their original positions and protected, avoiding damage that might occur during subsequent separation and individual component analysis.

Inventive Principle:

Principle #10Preliminary action

2Loss of information

If the circuit board is analyzed while assembled with the integrated circuit package, then assembly processes can be evaluated, but the circuit board structure prevents thorough analysis of the integrated circuit package components

Engineering Contradiction:

Improveassembly process evaluationVSAvoidcomponent analysis accessibility

Core Design Contradiction:

Loss of informationVSDifficulty of detecting and measuring

Solution Approach 1:

The integrated circuit package is separated from the circuit board to enable independent analysis of package components including the die, substrate, and encapsulant. This segmentation allows detailed examination of internal package structures that would be inaccessible while the package remains assembled on the circuit board.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The integrated circuit package is extracted from the circuit board assembly, allowing the die and other internal components to be removed and analyzed separately. This extraction enables comprehensive failure analysis of package components without the constraints of the assembled structure.

Inventive Principle:

Principle #2Taking out (Extraction)

3Measurement precision

If the die is analyzed directly without protective measures, then analysis can be performed, but the die and substrate may be damaged during the analysis process

Engineering Contradiction:

Improvedie analysis accuracyVSAvoiddie and substrate integrity

Core Design Contradiction:

Measurement precisionVSStrength

Solution Approach 1:

A protective coating is applied to the die before analysis operations to cushion and protect the fragile die and substrate during handling and examination. This protective measure is applied beforehand to prevent damage while allowing detailed analysis to be performed on the protected component.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

A protective coating serves as an intermediary layer between the analysis tools and the die, allowing detailed examination to be performed while preventing direct contact that could cause damage. The coating mediates between the need for precise analysis and the need to preserve component integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables thorough analysis of solder bonds and integrated circuit packages without causing damage, allowing for identification of defects and improvements in assembly and testing processes, thereby enhancing circuit board quality and reliability.

Implementation Method 1

performing a dye mapping to analyze bonds between the integrated circuit package and the circuit board

Methodology Applied

Scientific EffectDye mapping:

Data Source

PatentUS8063656B1Method of enabling a circuit board analysis

Publication Date: 2011.11.22 XILINX INC

AI summary

A method of enabling a circuit board analysis is disclosed. The method comprising removing a portion of the circuit board on a first side of the circuit board opposite a second side of the circuit board having an integrated circuit package; removing the circuit board from the integrated circuit package; performing a dye mapping to analyze bonds between the integrated circuit package and the circuit board; and performing an analysis of the integrated circuit package.