Circuit Board Anomaly Detection via Multi-Stage Image Comparison
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Solution Overview
Problem
Circuit boards are vulnerable to tampering and damage during transportation between production stages, leading to security breaches and operational issues, and existing methods for detecting changes are time-consuming and ineffective in capturing alterations outside defined image sites.
Innovation Solution
Implementing an imaging system that captures images of circuit boards at multiple production stages for comparison, using an anomaly detection engine to identify unauthorized changes or damage by comparing images acquired at different stages, with the aid of identifiers to ensure image matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing methods for detecting changes are used, then detection capability is provided, but the process is time-consuming and ineffective in capturing alterations outside defined image sites
Solution Approach 1:
The patent divides the circuit board into multiple defined image sites, each captured by separate imaging devices. This segmentation allows parallel processing of multiple regions simultaneously, reducing overall detection time while maintaining comprehensive coverage of the entire circuit board surface.
Solution Approach 2:
The system pre-defines multiple image sites on the circuit board before inspection begins. By having predetermined capture locations and using multiple imaging devices positioned to capture these sites simultaneously, the system eliminates the need for sequential scanning, thereby reducing detection time while maintaining detection precision.
2Measurement precision
If comprehensive inspection of entire circuit board surfaces is performed, then detection accuracy is improved, but the process becomes time-consuming
Solution Approach 1:
The circuit board surface is divided into multiple defined image sites that are captured simultaneously by multiple imaging devices. This segmentation enables comprehensive coverage of the entire surface without requiring sequential inspection, thus maintaining detection accuracy while reducing inspection time.
Solution Approach 2:
Multiple imaging devices are combined to capture multiple image sites simultaneously. By merging the capabilities of multiple devices working in parallel, the system achieves comprehensive inspection coverage equivalent to examining the entire circuit board surface while completing the inspection in the time required for a single capture event.
3Productivity
If multiple imaging devices capture multiple surfaces simultaneously, then productivity is improved, but device complexity increases
Solution Approach 1:
The imaging system is segmented into multiple independent imaging devices, each responsible for capturing a specific image site. This modular segmentation allows each device to operate independently and simultaneously, increasing productivity while keeping individual device complexity manageable through functional specialization.
Solution Approach 2:
Multiple imaging devices perform the same imaging function simultaneously on different parts of the circuit board. This multi-functionality approach increases throughput by parallelizing the inspection process, while each individual device remains relatively simple in design, offsetting the overall system complexity through functional redundancy.
Data Source
AI summary
In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.