Circuit Board Auxiliary Seed Pattern for Electroplating Uniformity
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Solution Overview
Problem
The existing IC packaging technology for 3D display products faces challenges with electroplating uniformity, particularly in high-channel quantity applications, leading to accuracy issues and reduced product yield due to poor electroplating uniformity after thick Cu electroplating, which cannot meet the requirements of subsequent bonding processes.
Innovation Solution
A manufacturing method for a circuit board that includes forming seed patterns and an auxiliary seed pattern on a precursor substrate, with the auxiliary seed pattern located in a non-patterned area, separated from the seed patterns, and using an electroplating process to form pads, followed by removing the auxiliary film and applying protective and solder resist layers, enhancing electroplating uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thick Cu electroplating is performed on patterned areas with different bonding areas, then the channel quantity and functionality are increased, but the electroplating uniformity deteriorates
Solution Approach 1:
The patent applies local quality by creating different seed pattern structures in different bonding areas (OLB, FOF, ILB) with specific geometric characteristics tailored to each area's requirements. This allows each bonding area to receive customized electroplating conditions that optimize both channel quantity and electroplating uniformity for that specific location.
Solution Approach 2:
The patent implements preliminary action by forming seed patterns with specific geometric characteristics before the electroplating process. These pre-formed seed patterns serve as templates that guide the subsequent thick Cu electroplating, ensuring uniform deposition across different bonding areas and preventing electroplating defects.
2Device complexity
If electroplating is performed without auxiliary seed patterns, then the process is simpler, but the electroplating uniformity and bonding accuracy deteriorate
Solution Approach 1:
The patent uses auxiliary seed patterns as intermediary elements that are formed temporarily before the final seed patterns. These auxiliary patterns serve as mediators to establish uniform electroplating conditions across the entire substrate, including areas that will become bonding areas. The auxiliary patterns are subsequently removed, leaving only the necessary final seed patterns.
3Adaptability or versatility
If thick Cu electroplating is performed on all areas, then the channel quantity is increased, but the electroplating uniformity and product yield deteriorate
Solution Approach 1:
The patent applies local quality by forming seed patterns only in specific bonding areas (OLB, FOF, ILB) rather than uniformly across the entire substrate. This localized approach ensures that thick Cu electroplating occurs only where needed for functionality, while maintaining electroplating uniformity in each specific bonding area, thereby improving product yield.
Solution Approach 2:
The patent segments the substrate into different bonding areas (OLB, FOF, ILB) with distinct seed pattern configurations. This segmentation allows independent optimization of electroplating parameters for each area, ensuring both functionality and electroplating uniformity without compromising overall product yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly improves electroplating uniformity, reducing thickness differences between patterns and enhancing the product yield during bonding, achieving uniformity improvements from 40% to 4% in the motherboard and 23% to 17% in the bonding area, meeting the requirements for high-resolution 3D display products.
Implementation Method 1
forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process
Data Source
AI summary
Embodiments of the present disclosure provide a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for the circuit board includes: providing a precursor substrate; forming seed patterns and an auxiliary seed pattern on a side of the precursor substrate, where the seed patterns are located in the patterned areas, the auxiliary seed pattern is located in the non-patterned area, and the seed pattern and the auxiliary seed pattern are separated from each other; and forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process.