Circuit Board Bending Mechanism for Compact Display Integration
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Solution Overview
Problem
Existing electronic devices face challenges in reducing the space occupied by connection circuit boards, which can hinder the compact design and functionality of multimedia devices.
Innovation Solution
A bending device is employed to accommodate and mold connection circuit boards, utilizing a complex mechanism of reciprocating and rotating components to efficiently integrate circuit boards with display panels, allowing for a more compact electronic device design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If connection circuit boards are made larger to accommodate more components and connections, then functionality and connectivity are improved, but the space occupied increases
Solution Approach 1:
The patent applies dimensionality change by transitioning the connection circuit board from a flat 2D layout to a 3D bent structure. The bending device creates multi-level configurations where circuit traces and components are arranged across different spatial planes, allowing increased functionality without proportional increases in footprint area.
Solution Approach 2:
The patent implements nesting by folding and bending the connection circuit board to create nested layers. Multiple circuit boards or components are arranged in a compact nested configuration, where one board is positioned within or alongside another, maximizing space utilization while maintaining all necessary connections and functionalities.
2Area of stationary object
If connection circuit boards are bent to reduce space, then compactness is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-bending the connection circuit board in a controlled manufacturing process before final assembly. The bending device performs the complex shaping operation in advance, creating precisely formed bent boards that are then easily integrated into the final product, thereby managing manufacturing complexity through staged processing.
Solution Approach 2:
The patent segments the bending process into multiple controlled stages using a multi-component bending device. Different sections of the circuit board are bent independently through separate bending elements, allowing complex 3D shapes to be achieved through a series of simpler, manageable operations rather than a single complex transformation.
3Area of stationary object
If connection circuit boards are integrated closer to display panels, then device compactness is improved, but thermal management and signal interference challenges increase
Solution Approach 1:
The patent uses dimensionality change to vertically integrate the connection circuit board with the display panel through bending, creating a 3D stacked configuration. This vertical arrangement reduces horizontal spacing while maintaining adequate thermal separation and signal integrity through careful spatial design, allowing close integration without proportionally increasing thermal or electromagnetic interference.
Data Source
AI summary
A bending device includes a stage configured to accommodate a display panel; and a bending part adjacent to the stage and configured to accommodate a main circuit board, the bending part including a main plate reciprocating in the first direction; a first block on the main plate; a plurality of rotation supports arranged on sides of the first block, a second block between the rotation supports, coupled to the first block, and configured to reciprocate in a third direction; a third block closer to the stage than the second block is, between the rotation supports, and configured to rotate about a rotation axis parallel to a second direction; and a fourth block coupled to one side of the third block, and including a main body configured to reciprocate in the first direction and a sub-body coupled to the main body and configured to reciprocate in the third direction.