Circuit Board Buffer Layer for Adhesion and Density
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Solution Overview
Problem
Existing printed circuit boards face challenges in achieving high-frequency signal transmission due to insufficient adhesion between the circuit pattern and the insulating layer, which limits the reduction of circuit pattern spacing and line width.
Innovation Solution
A circuit board with a buffer layer containing carbon, nitrogen, and oxygen elements is introduced, where the nitrogen-to-carbon ratio is between 5 to 15 and the oxygen-to-carbon ratio is between 15 to 30, enhancing the adhesion between the insulating layer and the circuit pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the circuit pattern spacing and line width are reduced to increase density, then the adhesion between the circuit pattern and insulating layer becomes insufficient, but reducing spacing and line width is required for high-frequency applications
Solution Approach 1:
A buffer layer comprising carbon element, nitrogen element, and oxygen element is introduced between the circuit pattern and the insulating layer. This intermediary layer improves adhesion by providing chemical bonding sites that enhance the interface between the copper circuit pattern and the insulating layer, allowing reduced spacing and line width while maintaining reliability.
Solution Approach 2:
The buffer layer is formed as a composite material containing multiple elements (carbon, nitrogen, oxygen) with specific compositional ratios. This composite structure provides both mechanical support and chemical bonding capabilities, enabling the circuit pattern to maintain adhesion even when spacing and line width are reduced for higher density.
2Quantity of substance
If the circuit pattern line width is reduced to improve density, then the support force of the circuit pattern decreases, but maintaining support force is required for reliability
Solution Approach 1:
The buffer layer acts as a mediator that distributes mechanical stress and provides structural support to the thinned circuit pattern. By introducing this intermediate layer with appropriate mechanical properties, the circuit pattern can be made thinner for higher density while the buffer layer compensates for the reduced support force.
3Quantity of substance
If the spacing between circuit patterns is reduced to increase density, then the adhesion between adjacent patterns decreases, but improved adhesion is needed for high-frequency signal transmission
Solution Approach 1:
The buffer layer serves as a universal intermediary that improves adhesion between the circuit pattern and insulating layer, and also provides spacing control between adjacent patterns. This allows reduced spacing for higher density while maintaining manufacturing precision through the buffer layer's structural role.
Data Source
AI summary
A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.