Circuit Board Auxiliary Support Structure for Heat Sink Load Distribution

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Solution Overview

Problem

High-frequency and high-speed CPUs generate excessive heat, which can destabilize CPU operation and cause deformation or breakage of circuit boards due to the weight of metal heat sinks.

Innovation Solution

An auxiliary supporting structure for circuit boards, comprising a buffer body on a housing with a supporting element and an adjusting element, distributes the weight of the heat sink across the housing, preventing deformation of the circuit board and including an elastic or insulating element for secure CPU-heat sink contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal heat sink is used to remove heat from the CPU, then heat dissipation efficiency is improved, but the weight of the heat sink causes deformation or breakage of the circuit board

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcircuit board integrity
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent introduces a buffer body as an intermediary component between the circuit board and the heat sink fixing element. This buffer body absorbs and distributes the weight and pressure from the heat sink, preventing direct transmission of force to the circuit board. The buffer body acts as a mediator that enables the heat sink to be securely mounted while protecting the circuit board from deformation or breakage caused by the heat sink's weight.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the heat sink is tightly pressed against the CPU to improve heat dissipation, then heat dissipation efficiency is improved, but the circuit board may deform or break due to the applied pressure

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcircuit board stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent implements beforehand cushioning by installing a buffer body in advance at the location where the heat sink fixing element will be mounted. This buffer body is designed to cushion and absorb the pressure applied when the heat sink is tightly pressed against the CPU. By having this protective element in place before the heat sink is installed, the system prevents circuit board deformation or breakage while still allowing effective heat dissipation through tight CPU-heat sink contact.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS7352586B2Auxiliary supporting structure of circuit board and assembling method for the same
Publication Date: 2008.04.01 ASUSTEK COMPUTER INC
  • US7352586B2 patent drawing
  • US7352586B2 patent drawing
  • US7352586B2 patent drawing

AI summary

An auxiliary supporting structure of a circuit board is for supporting at least one part of the circuit board. The circuit board has a CPU socket for connected to a CPU, and a through hole through which a heat sink fixing element passes. The auxiliary supporting structure includes a buffer body and a supporting element. In this case, the buffer body is disposed on a housing and has a first surface facing the circuit board. The buffer body is positioned between the circuit board and the housing. The supporting element is disposed on the buffer body and faces the through hole. The heat sink fixing element passes through the through hole and is fixed to the supporting element. An assembling method for the auxiliary supporting structure of the circuit board is provided.