Circuit Board Buried Protrusion Pattern for Impact Resistance
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Solution Overview
Problem
Conventional circuit boards with fine circuit patterns face reliability issues due to the outermost circuit pattern collapsing under external impact, especially in the context of 5G communication systems where miniaturization and integration are critical.
Innovation Solution
The circuit board employs a novel structure where the second outer circuit pattern is divided into a buried pattern and a protrusion pattern. The buried pattern, with a width of 15 μm or less, is embedded in the insulating layer, while the protrusion pattern, with a wider width, protrudes on the surface. This configuration enhances the structural integrity and reliability of the fine circuit patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the circuit line width is miniaturized to increase circuit integration, then the circuit pitch is reduced and integration is improved, but the outermost circuit pattern becomes more susceptible to collapse under external impact
Solution Approach 1:
The outermost circuit pattern is segmented into two distinct parts: a buried pattern embedded within the insulating layer and a protrusion pattern extending above the insulating layer surface. This segmentation allows the fine circuit trace to be protected within the substrate while maintaining electrical connectivity through the via structure, thereby preventing collapse under external impact while preserving miniaturization benefits
Solution Approach 2:
The circuit pattern transitions from a two-dimensional surface configuration to a three-dimensional structure by embedding part of the pattern within the insulating layer and extending another part above the surface. This dimensional change creates a more robust structure that resists external impact while maintaining fine pitch dimensions
2Manufacturing precision
If the circuit pattern is embedded in the insulating layer to prevent etching loss, then manufacturing precision is improved, but the structural integrity and resistance to external impact deteriorates
Solution Approach 1:
The circuit pattern is divided into buried and protrusion portions, where the buried pattern provides etching protection through embedding while the protrusion pattern reinforces structural integrity and impact resistance
Solution Approach 2:
The circuit structure combines embedded copper foil within the insulating layer material to create a composite structure that leverages the protective properties of the insulating layer while maintaining the conductive properties of copper, achieving both manufacturing precision and structural strength
Data Source
AI summary
A circuit board according to an embodiment includes an insulating layer; a second outer circuit pattern disposed on an upper surface of the insulating layer; and a via disposed in the insulating layer and connected to the second outer circuit pattern; wherein the second outer circuit pattern includes: a first pattern embedded in the insulating layer and having a first width; and a second pattern protruding on the upper surface of the insulating layer, having a second width greater than the first width, and connected to the first pattern through the via.