Wiring Circuit Board Joint Structure for Burr-Controlled Cutting

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Solution Overview

Problem

The existing methods for producing circuit boards often result in burr formation during cutting, leading to decreased handleability and mountability due to non-flat surfaces and protruding burr pieces, which compromise the accuracy and longevity of the cutting process.

Innovation Solution

A method involving a wiring circuit board assembly sheet with a support sheet and joints having recessed thin portions, where the cutting blade is used to cut the thin portions in a way that the burr is directed inward, stabilizing the cutting process and reducing burr formation, and incorporating fragile portions to evenly distribute cutting forces and minimize shearing force differences.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the narrow piece is cut by pressing a cutting blade on one surface or irradiating a laser beam on the other surface, then the circuit board can be separated from the material substrate, but burr pieces protruding from the other surface easily occur, causing the surface to become non-flat and decreasing handleability and mountability

Engineering Contradiction:
Improveseparation of circuit board from material substrateVSAvoidflatness of surface
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The joint is divided into a thick portion and a thin portion, allowing differential cutting. The thin portion is cut to locate burr formation at one side in the thickness direction, while the thick portion remains intact to maintain surface flatness. This segmentation enables the cutting process to produce burrs in a controlled location that does not affect the overall surface flatness and handleability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the joint are given different thickness characteristics - the thin portion allows burr formation while the thick portion maintains structural integrity and surface flatness. This local differentiation of properties allows the cutting process to generate burrs in a localized area without compromising the overall surface quality and mountability of the circuit board.

Inventive Principle:
Principle #3Local quality

2Productivity

If the thin portion is cut simultaneously with the direct connection portion, then both can be separated, but the shearing force difference becomes excessive, making the cutting blade posture unstable and decreasing cutting accuracy

Engineering Contradiction:
Improvesimultaneous cutting of multiple portionsVSAvoidcutting accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The joint is segmented into a thin portion and a thick direct connection portion, allowing the cutting blade to engage with different thicknesses. The thin portion cuts easily with small shearing force, while the thick portion requires larger force. This segmentation enables simultaneous cutting of both portions while the blade posture remains stable due to the controlled engagement with the thin portion first.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cutting blade first engages with the thin portion, which requires minimal shearing force, establishing a stable cutting posture before proceeding to cut the thick direct connection portion. This preliminary action with the thin portion ensures that the blade is properly positioned and stabilized before encountering the thicker material, thereby maintaining cutting accuracy throughout the simultaneous cutting process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the handleability and mountability of the circuit boards by minimizing burr formation, improving cutting accuracy, and reducing the need for frequent cutting blade replacements, thus lowering production costs.

Implementation Method 1

the cutting blade in contact with the thin portion can cut the thin portion with a relatively small shearing force

Methodology Applied
Scientific EffectShearing force: Shear Stress

Data Source

PatentUS12167544B2Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet
Publication Date: 2024.12.10 NITTO DENKO CORP
  • US12167544B2 patent drawing
  • US12167544B2 patent drawing
  • US12167544B2 patent drawing

AI summary

A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.