Circuit Board Capacitor Design Eliminating Via Patterns
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The deterioration of capacitor characteristics in semiconductor modules due to via patterns on circuit boards, which can lead to reduced performance and reliability as semiconductor package sizes decrease.
Innovation Solution
A circuit board design featuring a first and second metal core with a dielectric layer between them, where the capacitor electrodes are directly connected to the sides of the metal cores without via patterns, using a multilayer ceramic capacitor structure to enhance capacitance while minimizing size and preventing formation issues associated with via patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via patterns are used to connect capacitor electrodes in a circuit board, then electrical connection is achieved, but capacitor characteristics deteriorate
Solution Approach 1:
The invention extracts and removes the harmful via pattern element from the capacitor electrode connection process. Instead of using via patterns to connect capacitor electrodes to the circuit board, the patent directly connects the capacitor electrodes to the metal cores, eliminating the via pattern and thus preventing the deterioration it causes to capacitor characteristics.
Solution Approach 2:
The invention introduces metal cores as intermediary elements between the capacitor electrodes and the circuit board. These metal cores serve as direct connection points that eliminate the need for via patterns, thereby preventing the harmful effects of via patterns on capacitor characteristics while maintaining proper electrical connection.
2Volume of moving object
If semiconductor package size is reduced, then integration density increases, but capacitor performance deteriorates due to via pattern constraints
Solution Approach 1:
The invention transitions from a vertical via-pattern-based connection approach to a lateral/direct connection approach using metal cores. This dimensional change in the connection methodology allows for reduced package size while maintaining capacitor performance, as the direct connection to metal cores eliminates the space and performance constraints associated with via patterns.
Solution Approach 2:
By removing the via pattern element from the connection structure, the invention enables smaller package sizes without the performance deterioration that via patterns cause. The direct connection to metal cores provides a more efficient space utilization that maintains capacitor performance at reduced sizes.
3Ease of manufacture
If via patterns are used for capacitor electrode connection, then manufacturing process is established, but manufacturing precision and reliability are compromised
Solution Approach 1:
The invention removes the via pattern step from the manufacturing process. By directly connecting capacitor electrodes to metal cores, the complex via formation and alignment processes are eliminated, replacing them with a simpler direct connection method that improves both manufacturing precision and capacitor characteristics.
Solution Approach 2:
Metal cores serve as intermediary connection points that simplify the manufacturing process. Instead of forming via patterns through the circuit board, the metal cores provide pre-established connection points that directly receive capacitor electrodes, improving manufacturing precision while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents capacitor deterioration, allows for smaller semiconductor devices with higher capacitance, and avoids the technical challenges of forming via patterns, thereby improving the reliability and performance of semiconductor modules.
Implementation Method 1
a dielectric layer between the first and second electrodes
Data Source
AI summary
In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a cross section, such that a first side of the first metal core faces a first side of the second metal core; a first electrode electrically connected to the first side of the first metal core; a second electrode electrically connected to the first side of the second metal core facing the first metal core; and a dielectric layer between the first and second electrodes.