Circuit Board Cavity Depth Control via Embedded Convex Conductive Film
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Solution Overview
Problem
Current methods for manufacturing circuit boards struggle with efficiently adjusting the depth of cavities and improving process efficiency in semiconductor packages, which are crucial for miniaturization and slimness demands in electronic devices.
Innovation Solution
A method involving a circuit board with a core insulating layer and a conductive thin film layer, where a convex portion is embedded in the insulating layer, allowing for the formation of a cavity and wiring patterns in a single process, enabling precise control over cavity depth and enhancing manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to manufacture circuit boards with cavities, then the basic structural requirements are met, but the cavity depth adjustment is inefficient and process efficiency is reduced
Solution Approach 1:
The patent applies preliminary action by forming the convex portion on the conductive thin film layer before embedding it in the core insulating layer. This convex portion serves as a pre-prepared structure that defines the cavity depth, eliminating the need for subsequent complex depth adjustment operations and improving both manufacturing precision and process efficiency
Solution Approach 2:
The patent segments the cavity formation process into distinct functional components: the convex portion on the conductive thin film layer defines the cavity depth, while the surrounding insulating material forms the cavity body. This segmentation allows independent optimization of cavity depth control and overall process efficiency
2Volume of moving object
If the circuit board structure is simplified for miniaturization, then device size is reduced, but maintaining structural integrity and electrical connectivity becomes more difficult
Solution Approach 1:
The conductive thin film layer with the convex portion serves multiple functions simultaneously: it provides the wiring pattern for electrical connectivity, defines the cavity depth through the convex portion height, and maintains structural integrity when embedded in the core insulating layer. This multi-functionality enables miniaturization without compromising reliability
Solution Approach 2:
The patent applies the nested doll principle by embedding the convex portion of the conductive thin film layer within the core insulating layer. The conductive structure is nested inside the insulating material, creating a compact integrated structure that maintains both electrical connectivity and structural integrity while reducing overall package size
Data Source
AI summary
A method of manufacturing a circuit board may include: preparing a circuit board body including an insulating layer having a first surface and a second surface opposite to the first surface and a first conductive thin film layer disposed on the first surface of the insulating layer and having a convex portion which is disposed on a first surface of the first conductive thin film layer and is embedded in the insulating layer; removing the convex portion to form a cavity corresponding to the convex portion in the insulating layer; and forming one or more first wiring patterns on the first surface of the insulating layer by removing first portions of the first conductive thin film layer. The one or more first wiring patterns correspond to second portions of the first conductive thin film layer not removed.