Circuit Board Cavity Embedding for Direct Multi-Chip Interconnection
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Solution Overview
Problem
Existing circuit board technologies face limitations in efficiently and cost-effectively connecting multiple chips due to the need for auxiliary substrates and fragile silicon bridges, which increase production costs and reduce yield.
Innovation Solution
A method of embedding an interconnection device in a cavity on the circuit board, aligning the height of the copper bumps of the interconnection device with the outer layer bumps, allowing direct mounting of chips without auxiliary buffering devices, using techniques like mechanical drilling and adhesive bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interposer technology is used to connect dies with fine pitch electrodes to copper pads with coarse pitch, then electrical connection is achieved, but auxiliary substrates are required which increases device complexity and manufacturing cost
Solution Approach 1:
The invention extracts and eliminates the interposer substrate from the system by directly forming conductive bumps on the circuit board to establish electrical connections between dies and copper pads, thereby removing the auxiliary substrate that caused device complexity and cost issues
2Reliability
If silicon bridge is embedded deep in the substrate for interconnecting chips, then chip interconnection is achieved, but the bridge is fragile and easily breakable due to bending which reduces production yield
Solution Approach 1:
The invention replaces the fragile silicon bridge with a more robust conductive bump structure that is directly formed on the circuit board, eliminating the bending-induced fragility and improving production yield through a simpler, more durable interconnection approach
3Reliability
If silicon bridge is buried deep in the board for chip interconnection, then chip connection is achieved, but the bridge surface requires additional interconnection connection (FLI) or joints which increases device complexity
Solution Approach 1:
The invention removes the need for additional interconnection connections by directly forming conductive bumps on the circuit board surface that provide both structural support and electrical connection, eliminating the separate FLI or joints that would be required for buried silicon bridges
4Reliability
If interposer substrate is used to connect multiple chips, then chip interconnection is achieved, but manufacturing cost increases due to extra auxiliary substrates
Solution Approach 1:
The invention extracts and eliminates the interposer substrate from the manufacturing process, directly forming conductive bumps on the circuit board to achieve chip interconnection, thereby removing the source of increased manufacturing costs associated with auxiliary substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables direct and cost-effective interconnection of multiple chips on a circuit board, eliminating the need for interposers and reducing manufacturing costs while maintaining high production yield.
Implementation Method 1
embedding an interconnection device in a cavity on the circuit board
Data Source
AI summary
The present invention is characterized by fabricating a cavity in the package substrate and embedding an interconnection device in the cavity, so that the height level of the upper copper bump of the interconnection device is aligned with that of the copper bump of the outer layer of the circuit board, which allows chips to be mounted not only on the interconnection device but on the outer layer of the circuit board in a simultaneous manner directly through the copper bumps of the interconnection device and the outer layer.