Circuit Board Cavity Formation Using Laser Drilling and Etching
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Solution Overview
Problem
Existing methods for forming cavities in antenna substrates are time-consuming and decrease productivity due to the use of laser drilling, and laser drill trimming methods face challenges with dry film resist acting as an anti-etching layer, leading to incomplete separation and residue issues.
Innovation Solution
A circuit board design with multiple insulation layers and an anti-etching layer to prevent excessive laser processing, combined with etching to form cavities, improving productivity and cleanliness of the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser drilling method is used to form cavity in antenna substrate, then cavity can be formed, but manufacturing time increases and productivity decreases
Solution Approach 1:
The cavity formation process is divided into two stages: first forming a through-hole using laser drilling, then expanding it into a full cavity through etching. This segmentation allows the laser to create only the initial opening rather than the complete cavity, significantly reducing laser processing time while achieving the desired cavity structure.
Solution Approach 2:
A release layer is applied to the front surface of the insulation layer before laser drilling. This release layer acts as a sacrificial element that facilitates easier separation of the cavity from the substrate during subsequent processing, preventing adhesion issues and enabling cleaner cavity extraction.
2Manufacturing precision
If laser drill trimming method using dry film resist as release layer is used, then cavity can be formed, but it is difficult to act as anti-etching layer, separate trimmed insulation layer neatly, and remove residual dry film resist
Solution Approach 1:
A release layer is introduced as an intermediary material between the insulation layer and the cavity formation process. This release layer serves multiple functions: it prevents adhesion during etching, enables clean separation of the cavity, and can be easily removed without leaving residues. The release layer acts as a mediator that solves the multiple problems associated with using dry film resist directly.
Solution Approach 2:
The problematic dry film resist is extracted from the process and replaced with a dedicated release layer that performs the necessary functions without the drawbacks. The release layer is applied, processed, and then completely removed, taking with it any potential contamination or adhesion issues that would otherwise remain in the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for efficient and neat formation of cavities, reducing manufacturing time and residue, thereby enhancing productivity and enabling thinner antenna modules.
Implementation Method 1
the laser drilling method requires forming a cavity on a front surface of the insulation layer of the antenna substrate using a laser beam
Implementation Method 2
forming a cavity by removing a portion containing the anti-etching layer and the dummy wire from the third insulation layer
Data Source
AI summary
A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.