Circuit Board Cavity Interconnect for Signal Integrity
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Solution Overview
Problem
Existing semiconductor packages face challenges with high material costs and complex manufacturing processes for silicon-based interposers, as well as reliability issues due to thermal expansion mismatches and power integrity deterioration.
Innovation Solution
A circuit board with a slimmed structure and a semiconductor package that includes a first insulating layer, a first circuit pattern layer, and a second insulating layer with a cavity, where the connection pattern part directly connects the first and second pad parts, minimizing signal transmission distance and eliminating the need for additional through electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a silicon-based interposer is used in a semiconductor package, then high-speed signal transmission is achieved, but material cost and manufacturing complexity increase significantly
Solution Approach 1:
The patent changes the material parameter from silicon to organic substrate, and changes the interconnect structure parameter from TSV to cavity-based connection. This allows achieving high-speed signal transmission through direct bonding without the complex TSV formation process, thereby reducing manufacturing complexity while maintaining signal transmission performance
Solution Approach 2:
The patent replaces expensive silicon interposers with cheaper organic substrates. The organic substrate serves as a cost-effective alternative that achieves the same functional purpose (signal transmission and electrical connection) without the high material cost and manufacturing complexity associated with silicon-based solutions
2Reliability
If a silicon-based interconnect bridge is used, then electrical connection is achieved, but reliability deteriorates due to CTE mismatch
Solution Approach 1:
The patent changes the substrate material parameter from organic to glass-inorganic composite material. This material substitution resolves the CTE mismatch issue because the glass-inorganic material has thermal expansion characteristics that are compatible with the semiconductor chips, thereby improving package reliability under thermal stress
Solution Approach 2:
The patent uses a composite material structure combining glass and inorganic materials in the substrate. This composite approach allows tuning of thermal and mechanical properties to match those of the semiconductor components, eliminating the harmful CTE mismatch effect while maintaining structural integrity
3Reliability
If additional through electrodes are added for connection, then electrical connectivity is improved, but device size increases
Solution Approach 1:
The patent merges the electrical connection function with the substrate structure itself. Instead of adding separate through electrodes as additional components, the substrate is designed with integrated conductive pathways and cavity structures that provide both mechanical support and electrical connectivity, thereby achieving compact integration without increasing overall device size
Data Source
AI summary
A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern layer disposed on the first insulating layer; and a second insulating layer disposed on the first circuit pattern layer and having a first cavity, wherein the first circuit pattern layer includes a first pad part vertically overlapping the first cavity; a second pad part that does not vertically overlap the first cavity; and a connection pattern part disposed between the first pad part and the second pad part, and the connection pattern part includes a first portion disposed inside the first cavity and connected to the first pad part, and a second portion disposed outside the first cavity and connected to the second pad part.