Circuit Board Cavity Structure for Higher-Density Mounting
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Solution Overview
Problem
Conventional circuit boards face challenges in high-density integration due to large cavity formation spaces, which increase the overall volume and reduce integration density, primarily because of the inclination angle of the inner wall of the cavity being greater than 150°, necessitating significant space for device mounting.
Innovation Solution
The circuit board design incorporates a first circuit pattern with varying thicknesses and inclination angles, utilizing a portion of the pattern as a stop layer for laser processing to form a cavity with controlled depth and width, reducing the inclination angle of the inner wall to improve integration density and minimize space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional cavity formation method is used with an inclination angle of 150° or more, then a mounting space for devices can be provided, but the space required for forming the cavity becomes relatively great, reducing integration density and increasing overall volume
Solution Approach 1:
The patent changes the inclination angle parameter of the cavity inner wall from the conventional 150° or more to less than 150°, specifically forming a first cavity portion with an inclination angle between 90° and 150° and a second cavity portion with an inclination angle between 0° and 90°. This parameter change reduces the cavity formation space while maintaining adequate mounting space for devices, thereby resolving the contradiction between providing mounting space and minimizing cavity volume.
2Volume of stationary object
If the inclination angle of the inner wall is reduced to improve integration density, then the overall volume decreases, but the manufacturing precision and adhesion in the cavity region may be compromised
Solution Approach 1:
The patent segments the cavity into two distinct portions: a first cavity portion with an inclination angle between 90° and 150° and a second cavity portion with an inclination angle between 0° and 90°. This segmentation allows each portion to be optimized for different functions - the first portion provides structural stability and adhesion, while the second portion maximizes space efficiency. The segmented approach enables precise manufacturing control for each section, resolving the contradiction between reducing volume and maintaining manufacturing precision.
Solution Approach 2:
The patent applies different inclination angle characteristics to different regions of the cavity - the first cavity portion has a larger inclination angle (90°-150°) for better adhesion and structural integrity, while the second cavity portion has a smaller inclination angle (0°-90°) for space efficiency. This local quality differentiation ensures that each region of the cavity is optimized for its specific functional requirements, maintaining manufacturing precision while reducing overall volume.
3Ease of manufacture
If a uniform thickness circuit pattern is used, then the manufacturing process is simpler, but the adhesion in the cavity region is insufficient and the overall structure is not optimized
Solution Approach 1:
The patent implements a circuit pattern with non-uniform thickness - a first circuit pattern portion with a first thickness and a second circuit pattern portion with a second thickness different from the first. The second circuit pattern portion, located in the cavity region, has optimized thickness to enhance adhesion between the circuit board and the mounted device. This local quality variation in thickness allows the circuit pattern to provide both structural support and enhanced adhesion in the cavity region, resolving the contradiction between manufacturing simplicity and adhesion reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise cavity formation, enhancing integration density and reducing the circuit board's overall volume while improving adhesion and reliability through controlled laser processing and the use of RCC insulating layers, which maintain structural integrity and reduce signal loss in high-frequency applications.
Implementation Method 1
utilizing a portion of the pattern as a stop layer for laser processing to form a cavity with controlled depth and width
Data Source
AI summary
A circuit board including a first insulating layer; a first circuit pattern disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity. An upper surface of the first insulating layer includes a first region that does not vertically overlap the cavity; a second region vertically overlapping the cavity; and a boundary region between the first region and the second region. The first circuit pattern includes a first-first circuit pattern disposed on the boundary region of the first insulating layer. The first-first circuit pattern includes a first portion that does not vertically overlap the cavity, and a second portion connected to the first portion and vertically overlapping the cavity. A thickness of the first portion of the first-first circuit pattern is different from a thickness of the second portion of the first-first circuit pattern.