Circuit Board Heat Dissipation via Cavity Penetration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As electronic devices, such as mobile phones, become smaller and more powerful, they generate significant heat due to increased data transmission, leading to performance instability and the need for effective heat dissipation in circuit boards.
Innovation Solution
A circuit board design featuring a first insulating layer with a cavity and a heat dissipation pattern on its surface, along with a heat dissipation part that protrudes into the cavity, effectively absorbing and dissipating heat from electronic components while maintaining mounting space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a cavity is formed in the circuit board to accommodate electronic components, then the mounting space for electronic components is secured, but the heat dissipation capability is reduced
Solution Approach 1:
The heat dissipation function is segmented into multiple parts: a first heat dissipation pattern on the bottom surface of the cavity and a second heat dissipation pattern on the top surface of the circuit board. This segmentation allows the cavity space to be fully utilized for mounting while distributing heat dissipation across multiple locations, resolving the contradiction between mounting space and heat dissipation capability.
Solution Approach 2:
The heat dissipation structure extends into the third dimension by forming via holes through the circuit board thickness. The via holes contain heat dissipation patterns that connect the bottom and top surfaces, creating a vertical heat dissipation pathway. This dimensional extension allows effective heat dissipation without compromising the horizontal mounting space within the cavity.
2Temperature
If heat dissipation patterns are added to the circuit board, then the heat dissipation capability is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation patterns are merged with the existing circuit board layers. The first heat dissipation pattern is integrated into the bottom insulating layer, and the second heat dissipation pattern is integrated into the top insulating layer. The via holes containing heat dissipation patterns are combined with existing via structures. This merging approach improves heat dissipation without significantly increasing structural complexity.
Solution Approach 2:
The via holes serve multiple functions: they provide mechanical support for mounting, enable electrical connections through the board, and contain heat dissipation patterns for thermal management. The heat dissipation patterns themselves serve dual purposes by conducting heat and providing structural reinforcement. This multi-functionality reduces the need for separate dedicated heat dissipation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed circuit board efficiently absorbs and dissipates heat from electronic components, ensuring stable performance and accommodating components of various thicknesses, even with complex circuit pattern designs.
Implementation Method 1
a heat dissipation part connected to the first heat dissipation pattern, and protruding into the cavity by penetrating through the first insulating layer
Data Source
AI summary
A circuit board includes: a first insulating layer having first and second surfaces opposing each other, and having a cavity recessed from the first surface; a first heat dissipation pattern disposed on the second surface of the first insulating layer; and a heat dissipation part connected to the first heat dissipation pattern, and protruding into the cavity by penetrating through the first insulating layer.