Circuit Board Thermal Management via Composite Insulating Layers
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Solution Overview
Problem
Current circuit boards do not effectively accelerate the thermal energy transfer rate of electronic components, which can lead to overheating issues in devices like mobile phones and computers.
Innovation Solution
A circuit board design incorporating a metal pattern layer, a thermally conductive plate, an electrically insulating layer, and an electrically insulating material with higher thermal conductivity, where the insulating material covers uncovered areas of the thermally conductive plate and is thermally coupled to it, enhancing thermal energy transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional circuit board structure is used, then the device structure is simple, but the thermal energy transfer rate is slow causing overheating
Solution Approach 1:
The circuit board is divided into multiple functional layers: a first electrically insulating layer, a second electrically insulating layer, and a thermally conductive layer positioned between them. This segmentation allows each layer to perform its specific function - electrical insulation and thermal conduction - thereby improving thermal energy transfer rate while maintaining a manageable structural complexity
Solution Approach 2:
The thermally conductive layer acts as an intermediary between the first and second electrically insulating layers. This intermediate layer specifically facilitates thermal energy transfer from electronic components while the insulating layers provide electrical isolation, thus resolving the contradiction between thermal conduction and electrical insulation requirements
2Temperature
If materials with higher thermal conductivity are used, then thermal energy transfer is accelerated, but material cost increases
Solution Approach 1:
The thermally conductive layer is positioned specifically at the location where thermal energy transfer is most needed - between the electronic components and the substrate. This localized application of high thermal conductivity material ensures effective heat dissipation while minimizing the overall quantity of expensive thermal conductive materials used in the circuit board
Solution Approach 2:
The circuit board employs a composite structure combining different materials with complementary properties: electrically insulating materials for electrical isolation and a thermally conductive material for heat transfer. This composite approach allows optimization of both electrical and thermal performance while controlling material costs through selective material placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly accelerates thermal energy transfer, reducing the likelihood of electronic component overheating and minimizing material usage and manufacturing costs by leveraging materials with higher thermal conductivity.
Implementation Method 1
a thermal conductivity of the electrically insulating material is larger than the thermal conductivity of the electrically insulating layer
Data Source
AI summary
A circuit board includes a metal pattern layer, a thermally conductive plate, an electrically insulating layer, and at least one electrically insulating material. The thermally conductive plate has a plane. The electrically insulating layer is disposed between the metal pattern layer and the plane and partially covers the plane. The electrically insulating material covers the plane where is not covered by the electrically insulating layer and touches the thermally conductive plate. The electrically insulating layer exposes the electrically insulating material, and a thermal conductivity of the electrically insulating material is larger than a thermal conductivity of the electrically insulating layer.