Circuit Board Connection Structure Using Conductive Post
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Solution Overview
Problem
The PIN hole insertion method for connecting antennas to circuit boards becomes increasingly difficult as wiring density increases, leading to issues with hole diameter reduction and potential loosening during insertion, affecting signal transmission.
Innovation Solution
A circuit board connection structure and method involving a pyrolytic adhesive layer and copper foil layers, with through holes exposing solder pads and a conductive post formed by copper plating, simplifying the connection process and stabilizing signal transmission by eliminating the need for PIN insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If PIN hole insertion method is used to connect antennas to circuit boards, then the connection process is simple, but the manufacturing difficulty increases as wiring density increases and hole diameter becomes smaller
Solution Approach 1:
The patent extracts the antenna connection function from the traditional PIN hole insertion method and implements it through a conductive post structure that integrates with the circuit board's wiring layers. The conductive post is formed by filling holes with conductive material and plating, eliminating the need for separate PIN holes and simplifying the overall manufacturing process while maintaining precision.
Solution Approach 2:
The patent merges the antenna connection function with the circuit board's wiring structure by integrating the conductive post into the multi-layer wiring system. The conductive post is formed within holes that are part of the circuit board's layered structure, combining the antenna connection and circuit wiring into a unified manufacturing process.
2Reliability
If PIN hole insertion method is used, then antenna connection is achieved, but the PIN hole may age and loosen during insertion, affecting signal transmission
Solution Approach 1:
The patent replaces the mechanical PIN hole insertion system with an integrated conductive post structure that is formed as part of the circuit board's wiring layers. The conductive post is created through a multi-step process involving hole formation, conductive material filling, and metal plating, resulting in a more stable and reliable electrical connection that eliminates the loosening issue associated with mechanical insertions.
3Adaptability or versatility
If wiring density on circuit board increases, then circuit functionality is improved, but the diameter of PIN holes must be reduced, making antenna insertion difficult
Solution Approach 1:
The patent extracts the antenna connection function from the traditional PIN hole insertion method and implements it through a conductive post structure that integrates with the circuit board's wiring layers. The conductive post is formed by filling holes with conductive material and plating, eliminating the need for separate PIN holes and simplifying the overall manufacturing process while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the electrical connection between the antenna and circuit board, stabilizes signal transmission, and reduces signal resistance and module thickness, improving space utilization with a three-dimensional pure metal antenna module.
Implementation Method 1
forming a copper plating layer on the second copper foil layer, and the copper plating layer further infilling in each of the plurality of through holes to form a conductive post
Implementation Method 2
heating and washing the intermediate body to remove the first pyrolytic adhesive layer and the second pyrolytic adhesive layer
Data Source
AI summary
A preparation method for a circuit board connection structure includes: providing a circuit board module that including a first outer wiring layer, and the first outer wiring layer including solder pads; forming a first pyrolytic adhesive layer and an inner wiring layer on the first outer wiring layer; forming a second pyrolytic adhesive layer and a second copper foil layer on the inner wiring layer; defining a plurality of through holes each configured to expose one of the solder pads; forming a copper plating layer on the second copper foil layer; etching the copper plating layer and the second copper foil layer to form a second outer wiring layer, thereby obtaining an intermediate body; heating and washing the intermediate body to remove the first pyrolytic adhesive layer and the second pyrolytic adhesive layer. The present application also provides a circuit board connection structure.