Circuit Board Convex Insulating Layers for Roll-to-Roll Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing printed circuit boards face adhesion issues between the second insulating layer and the circuit pattern layer or the first insulating layer, leading to physical reliability problems such as delamination, especially during the roll-to-roll manufacturing process.
Innovation Solution
A circuit board structure is introduced with a convex part formed on the surface of at least one insulating layer, enhancing the lamination process efficiency and ensuring secure adhesion between the insulating layers and the electrode parts, thereby facilitating the roll-to-roll manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a one-layer second insulating layer is used, then the manufacturing process is simple, but the adhesion between the second insulating layer and the circuit pattern layer/first insulating layer is not secured
Solution Approach 1:
The second insulating layer is divided into multiple sub-layers (second insulating layer 112a, 112b, 112c) with different material properties. The first sub-layer (112a) contains glass fibers for strength, the second sub-layer (112b) contains no glass fibers for better adhesion, and the third sub-layer (112c) contains glass fibers again. This segmentation allows each sub-layer to perform its specific function, resolving the contradiction between structural simplicity and adhesion reliability.
2Ease of manufacture
If adhesion between insulating layers is not secured, then the manufacturing process is easier, but bubble-like voids are formed causing physical reliability problems
Solution Approach 1:
The second insulating layer is designed with spatially varying material properties. The middle sub-layer (112b) specifically excludes glass fibers to create a region with enhanced adhesion characteristics, while the outer sub-layers (112a, 112c) include glass fibers for structural integrity. This local quality variation ensures proper adhesion at critical interfaces without compromising overall structural strength, preventing void formation while maintaining manufacturability.
3Productivity
If a conventional insulating layer structure is used, then the manufacturing process is standard, but it is difficult to manufacture through roll-to-roll process
Solution Approach 1:
The second insulating layer's material composition is specifically adjusted for roll-to-roll manufacturing. By creating a multi-sub-layer structure where the middle sub-layer (112b) has no glass fibers, the material parameters (viscosity, flow characteristics) are optimized to enable proper lamination during the roll-to-roll process. This parameter change allows the conventional manufacturing method to be adapted for automated roll-to-roll production while maintaining product quality.
Data Source
AI summary
A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a first electrode part disposed on the second insulating layer; a second electrode part disposed on the first electrode part; a second insulating layer disposed on the second electrode part; and a fourth insulating layer disposed on the third insulating layer, wherein an upper surface of the first insulating layer includes a plurality of first convex parts, wherein a lower surface of the fourth insulating layer includes a plurality of second convex parts, and wherein at least one of distances between adjacent first convex parts among the plurality of first convex parts includes a region different from at least one of distances between adjacent second convex parts among the plurality of second convex parts.