Circuit Board Coolant Manifold for Space-Saving Chassis Cooling
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Solution Overview
Problem
Existing dielectric coolant distribution systems in IT chassis are complex, space-consuming, and difficult to maintain, with hoses and pipes complicating access and requiring significant space, leading to inefficiencies in cooling and component accessibility.
Innovation Solution
A manifold system utilizing a circuit board to distribute dielectric coolant, with apertures and gaps allowing coolant to flow directly to components, eliminating the need for additional hoses and manifolds, and enabling quick release connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional hoses and pipes are used for coolant distribution, then coolant can be delivered to components, but the system becomes complex and space-consuming
Solution Approach 1:
The circuit board is merged with the coolant distribution manifold, integrating the electrical circuitry and fluid distribution functions into a single component. This eliminates the need for separate hoses and pipes, reducing system complexity while maintaining reliable coolant delivery to electronic components
Solution Approach 2:
The circuit board performs multiple functions: it provides electrical connections for components and simultaneously serves as the coolant distribution manifold with integrated channels. This multi-functionality reduces the number of separate components needed in the system
2Reliability
If traditional hoses and pipes are used for coolant distribution, then coolant can be delivered to components, but significant space is required
Solution Approach 1:
The coolant distribution channels are merged into the circuit board structure itself, utilizing the board's existing volume rather than requiring additional space for separate piping. This integration dramatically reduces the overall volume required for the cooling system
Solution Approach 2:
The coolant channels are nested within the circuit board structure, with channels formed in the board's thickness. This nesting approach allows the cooling system to occupy the same spatial envelope as the electrical circuitry, minimizing additional space requirements
3Reliability
If traditional hoses and pipes are used for coolant distribution, then coolant can be delivered to components, but maintenance becomes difficult
Solution Approach 1:
The coolant distribution function is extracted from separate flexible hoses and pipes and integrated into the rigid circuit board structure. This extraction eliminates the complex connections and joints that are difficult to access and maintain, as the integrated manifold has no separate connection points requiring service
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces complexity, saves space, lowers costs, and facilitates easier maintenance by simplifying coolant distribution, allowing for higher component density and efficient cooling without the need for additional manifolds or hoses.
Implementation Method 1
a dielectric coolant distribution manifold configured to receive dielectric coolant and distribute the dielectric coolant to allow the dielectric coolant to receive heat from at least one electronic component
Data Source
AI summary
A manifold is provided for distribution of dielectric coolant within a chassis, to allow the dielectric coolant to receive heat from at least one electronic component mounted within the chassis. The manifold comprises: a circuit board, having first and second opposing surfaces; and a substrate, at least partially spaced apart from the circuit board and a gap between a first surface of the circuit board and the substrate being configured to receive and contain dielectric coolant. One or more apertures are provided in the circuit board or substrate to allow dielectric coolant contained in the gap to flow across the opposing surfaces of the circuit board or substrate.