Insulated Circuit Board Corner Spacers to Prevent Sealing Burrs
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Solution Overview
Problem
Semiconductor devices with warped insulated circuit boards experience gaps at the corners, leading to poor thermal conductivity due to burr formation from excess sealing material, which reduces heat dissipation and increases manufacturing costs, and can cause stress on the device, affecting reliability.
Innovation Solution
Incorporating spacer parts at the corners of the insulated circuit board to prevent the sealing material from entering gaps, ensuring proper encapsulation and reducing burr formation, while maintaining thermal conductivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulated circuit board is heated during sealing operation, then the sealing member is properly cured and bonded, but the insulated circuit board warps to be convex downward forming gaps at the corners
Solution Approach 1:
The patent applies preliminary anti-action by providing spacer parts at the four corners of the insulated circuit board before the sealing operation. These spacer parts preemptively counteract the warping effect that occurs during heating, preventing the board from warping convex downward and forming gaps. The spacers maintain contact between the board corners and the mold installation surface throughout the sealing process, eliminating the root cause of burr formation while allowing the sealing member to be properly cured and bonded.
2Reliability
If the sealing member is injected into the cavity to fill gaps, then complete encapsulation is achieved, but burrs form on the undersurface reducing heat dissipation
Solution Approach 1:
The spacer parts serve as preliminary anti-action measures that prevent the formation of gaps between the insulated circuit board corners and the mold installation surface. By maintaining continuous contact at the corners during sealing, the spacers prevent sealing material from entering and forming burrs, thereby preserving heat dissipation efficiency while still achieving complete encapsulation of the semiconductor device.
Solution Approach 2:
The spacer parts act as intermediary elements between the insulated circuit board and the mold installation surface. They mediate the interaction during sealing operation, ensuring that the board corners remain in contact with the mold surface while allowing the sealing member to flow and cure properly. This intermediary role prevents direct formation of burrs that would otherwise occur at the gaps.
3Manufacturing precision
If an additional step of removing burrs is added, then manufacturing precision is improved, but manufacturing costs increase
Solution Approach 1:
The patent applies preliminary action by incorporating spacer parts into the insulated circuit board structure before the sealing operation. This preliminary measure prevents burr formation at the source, eliminating the need for subsequent burr removal steps. The spacers ensure that no gaps form at the corners during sealing, so no burrs are generated, thereby maintaining manufacturing precision while reducing manufacturing complexity and cost.
4Ease of manufacture
If the burrs are not removed, then manufacturing cost is reduced, but excessive stress is exerted on the semiconductor device reducing reliability
Solution Approach 1:
The spacer parts provide preliminary anti-action by preventing gap formation and subsequent burr creation during the sealing process. By maintaining continuous contact between the board corners and the mold surface, the spacers eliminate the condition that would lead to burr formation. This prevents excessive stress on the semiconductor device while avoiding the need for additional burr removal steps, thereby maintaining both reliability and manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents burr formation, enhances heat dissipation, and maintains the reliability of semiconductor devices by ensuring proper encapsulation and reducing manufacturing costs.
Implementation Method 1
the injected sealing member becomes cured
Implementation Method 2
the insulated circuit board with the semiconductor chips bonded thereto sometimes warps to be convex downward by heat produced during sealing operation
Data Source
AI summary
A semiconductor device includes a semiconductor chip, an insulated circuit board including a metal plate, an insulating plate and a circuit pattern, each of which has a rectangular shape, and a spacer part disposed on the periphery of a rear surface of the metal plate including at least one of the four corners thereof. The spacer part protrudes from a rear surface of the metal plate in the thickness direction away from a front surface of the insulated circuit board.