Circuit Board Production Method Using Coupling Sections
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Solution Overview
Problem
Conventional circuit board production methods require additional positioning means to secure multiple electrically conducting paths accurately, which can lead to positional shifts and increased complexity.
Innovation Solution
A method involving die punching to form coupled circuit patterns on a plate-shaped conductor, where the coupling sections allow for secure attachment to an insulating member without relative positional shifts, enabling precise and stable mounting of circuit patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple electrically conducting paths are secured independently to a substrate, then each path can be positioned accurately, but additional positioning pins are required increasing device complexity
Solution Approach 1:
The patent merges multiple independently positioned electrically conducting paths into a single integrated structure formed by die-punching a plate-shaped conductor. The conductor is formed with multiple circuit patterns that are structurally connected through coupling sections, eliminating the need for separate positioning pins for each path while maintaining relative positional accuracy.
2Manufacturing precision
If additional positioning pins are provided in electrically conducting paths, then positioning accuracy is improved, but the production process becomes more complex
Solution Approach 1:
The patent segments the plate-shaped conductor into multiple circuit patterns during the die-punching process, with coupling sections remaining to maintain structural connection. This segmentation allows each circuit pattern to be formed precisely in its designated position while the coupling sections ensure relative positions remain unchanged, simplifying the overall production process by eliminating separate positioning steps.
3Manufacturing precision
If circuit patterns are formed with coupling sections, then relative positions remain unchanged during securing, but additional material is used for coupling sections
Solution Approach 1:
The coupling sections serve a temporary function during the securing process to maintain relative positions of circuit patterns. After the circuit patterns are securely attached to the substrate, the coupling sections can be removed or discarded, as they have fulfilled their positioning function. This allows the use of minimal additional material that is later eliminated.
Data Source
AI summary
Provided is a circuit board manufacturing method capable of securing circuit patterns on a plate-like insulator while keeping the relative position between the circuit patterns, and also provided is a circuit board in which the relative position between a plurality of circuit patterns is kept. A first coil (30) having one turn is formed in a planar shape from a metal plate. Next, a second coil (40) having four turns is formed in a planar shape from a metal plate, wherein both of the ends (41, 42) of the coil are linked to other adjacent regions via linking portions (43, 44). A pair of the first coil (30) and the second coil (40) are then overlapped so as to face each other through a plastic plate (50) in which a plurality of prepregs are stacked, after which the links by the linking portions (43, 44) are disconnected.