Circuit Board Cover with Flow-Guide and Heat Pipe
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The rapid increase in heating power of electronic components in computers leads to overheating, making it necessary to expose circuit boards outside for better heat dissipation, which is aesthetically unpleasing and poses safety risks due to exposed components and potential electric shocks.
Innovation Solution
A cover for the circuit board module is designed with a flow-guide structure to enhance airflow for heat dissipation, shielding electronic components while exposing connectors, thereby improving aesthetics and safety, and incorporating a heat pipe for additional heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the circuit board is exposed outside the computer system for better heat dissipation, then the heat dissipation efficiency is improved, but the aesthetics deteriorates and safety risks increase due to exposed components and aculeate portions
Solution Approach 1:
The patent applies a cover made of a thin, flexible material that can be placed over the circuit board. This cover shields the aculeate portions and electronic components from accidental contact while allowing heat to dissipate through the material, thus resolving the contradiction between safety/aesthetics and heat dissipation efficiency
Solution Approach 2:
The cover acts as an intermediary layer between the exposed circuit board and the external environment. It mediates by providing physical protection against contact hazards while maintaining thermal exchange, thus improving safety without compromising heat dissipation
2Object-affected harmful factors
If the circuit board is covered to improve aesthetics and safety, then safety risks and aesthetics are improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The cover is designed as a thin, flexible film that provides safety protection while maintaining thermal conductivity. This allows heat to pass through the covering material effectively, preventing the deterioration of heat dissipation efficiency that would normally occur with covering
3Object-affected harmful factors
If electronic components are shielded by a cover, then safety against electric shock and accidental contact is improved, but access to connectors and components deteriorates
Solution Approach 1:
The cover is segmented with openings positioned at locations where connectors are present. This segmentation allows users to access specific connectors while the rest of the circuit board remains covered and protected, thus resolving the contradiction between safety and ease of operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances heat dissipation efficiency, provides a safer and more aesthetically pleasing design by shielding components and guiding airflow, while preventing accidental contact and electric shocks.
Implementation Method 1
The circuit board further may include a heat pipe contacting with the electronic components. The airflow generated by the fan passes through the heat pipe and removes the heat on the heat pipe.
Implementation Method 2
a heat pipe contacting with the electronic components. The airflow generated by the fan passes through the heat pipe and removes the heat on the heat pipe.
Implementation Method 3
The airflow generated by the fan passes through the heat pipe and removes the heat on the heat pipe.
Implementation Method 4
The airflow generated by the fan passes through the heat pipe and removes the heat on the heat pipe.
Data Source
Figure 1
Figure 2
AI summary
A circuit board module includes a circuit board, a plurality of electronic components, a plurality of connectors and a cover. The circuit board includes a heat dissipation unit. The electronic components, the connectors and the heat dissipation unit are disposed on a first surface of the circuit board. The cover has a plurality of openings with the shapes and the sizes corresponding to the connectors and the heat dissipation unit. When the cover covers the circuit board, the openings expose the connectors and the heat dissipation unit. Users can plug and pull the connectors of the circuit board through the openings. The size of the cover is corresponding to the circuit board. The circuit board module is dust-proof and can prevent the users from accidentally touching the electronic components.