Circuit Board Deflector Airflow Modification
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Solution Overview
Problem
Circuit board assemblies often develop hotspots that cannot be effectively cooled by traditional air cooling methods, which rely on creating turbulent airflow but fail to address localized heat issues efficiently.
Innovation Solution
The use of deflectors, potentially with an airfoil shape, positioned over electronic components to modify airflow speed and direction, either singly or in pairs connected by a connector, to enhance thermal management and convective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional turbulent airflow cooling is used, then overall cooling coverage is provided, but localized hotspot cooling effectiveness deteriorates
Solution Approach 1:
The patent applies local quality by positioning deflectors specifically over hotspot regions to create localized flow modification. The deflectors are strategically placed only where hotspots occur rather than uniformly across the entire circuit board, allowing targeted cooling enhancement where needed most while maintaining overall system cooling effectiveness.
Solution Approach 2:
The deflector acts as an intermediary element between the airflow and the electronic component hotspot. It modifies the airflow characteristics (creating turbulence and increasing velocity) before the air reaches the hotspot region, thereby enhancing heat transfer without requiring direct contact or complex cooling infrastructure.
2Temperature
If airflow turbulence is increased to cool hotspots, then heat transfer improves, but energy loss increases
Solution Approach 1:
The patent applies partial action by creating turbulence only in the immediate vicinity of hotspots using deflectors, rather than generating turbulence across the entire airflow path. This localized approach achieves the necessary heat transfer enhancement at the critical regions while minimizing overall energy loss in the airflow system.
3Temperature
If deflectors are added to modify airflow, then hotspot cooling improves, but device complexity increases
Solution Approach 1:
The cooling system is segmented into discrete deflector elements positioned at specific hotspot locations rather than implementing a unified complex cooling system across the entire circuit board. Each deflector is an independent, simple component that can be individually optimized and positioned, reducing overall system complexity while achieving targeted cooling效果.
Solution Approach 2:
The deflectors are designed as simple, inexpensive components with straightforward geometries that can be easily manufactured and integrated. Their simplicity allows for low-cost implementation and easy replacement if needed, avoiding the need for complex, expensive cooling system infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the heat transfer coefficient by 2-23% across various airflow speeds, effectively addressing hotspot cooling challenges and enhancing thermal management in circuit board assemblies.
Implementation Method 1
The deflector can be configured to increase a speed of air flow over the electronic component or alter the airflow currents
Implementation Method 2
enhancing thermal management and convective cooling
Implementation Method 3
The deflector can include an airfoil shape
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A circuit board arrangement includes a deflector (105) configured to guide flow over an electronic component (107) on a circuit board (109) disposed in an air flow. A method for thermal management of a circuit board (109) includes modifying an air flow over the circuit board (109) to increase speed or direction the air flow over a component (107) of the circuit board (109) using a deflector (105).