Circuit Board Deformation Points for Ring Laser Gyroscope Thermal Stress

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Solution Overview

Problem

Ring Laser Gyroscopes (RLGs) experience performance errors and power loss due to mechanical bending of the laser block caused by thermal expansion differences between components and the laser block material, leading to misalignment of internal mirrors and reduced gyro performance.

Innovation Solution

A circuit board assembly with deformation points, created by cutouts or specific geometries, is attached to the laser block using an adhesive with a low modulus of elasticity and glass transition temperature to absorb thermal stresses and minimize block bending. The deformation points absorb thermal expansion and compression stresses, reducing the transfer of these stresses to the laser block.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If components are rigidly mounted to the laser block, then mechanical stability is improved, but thermal expansion differences cause block bending and mirror misalignment

Engineering Contradiction:

Improvemechanical stabilityVSAvoidmirror alignment precision

Core Design Contradiction:

Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The circuit board is segmented by introducing deformation points (cutouts or reduced cross-sectional area regions) that divide the board into sections capable of independent thermal deformation, preventing stress transfer to the laser block while maintaining component mounting stability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The circuit board geometry is modified by changing the cross-sectional area at specific locations to create deformation points that can accommodate thermal expansion differences between the circuit board and laser block, preventing block bending

Inventive Principle:

Principle #35Parameter changes

2Strength

If the circuit board is made rigid to maintain structural integrity, then mechanical strength is improved, but thermal stresses cause block bending

Engineering Contradiction:

Improvecircuit board structural integrityVSAvoidthermal stress-induced block bending

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

Deformation points are pre-introduced into the circuit board design to absorb and cushion thermal stresses before they can transfer to the laser block, preventing block bending while maintaining overall board strength

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The circuit board incorporates flexible regions at deformation points that can deform under thermal stress, acting as a compliant interface between the rigid circuit board and laser block to prevent stress-induced bending

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively minimizes block bending in the laser block, maintaining the internal alignment of mirrors and improving the performance and power of the ring laser gyroscope by reducing thermal stress transfer.

Implementation Method 1

at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS8901432B2Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board

Publication Date: 2014.12.02 HONEYWELL INTERNATIONAL INC

AI summary

An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.