Circuit Board Deformation Suppression in Sealed Electronic Equipment
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Solution Overview
Problem
Existing cooling techniques for electronic equipment, where a heating element and coolant are sealed in a space surrounded by a circuit board and housing, face issues such as coolant leakage and wiring damage due to increased pressure and deformation of the circuit board.
Innovation Solution
The solution involves a configuration where a deformation suppressing portion is mounted on the circuit board to enhance its rigidity, and a housing is designed to accommodate the coolant and heating element without covering the connector portion, allowing for efficient heat dissipation through phase change of the coolant, while preventing deformation and leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heating element and coolant are sealed in a space surrounded by a circuit board and housing, then cooling efficiency is improved, but the circuit board deforms due to increased inner pressure
Solution Approach 1:
The housing is divided into a lower housing and an upper housing that are coupled together. The coupling portion of the lower housing is positioned at a region distant from the heating element, allowing the sealed space to be segmented and the circuit board to be relieved from continuous pressure stress, thereby preventing deformation while maintaining cooling efficiency
Solution Approach 2:
The coupling portion is positioned in a direction extending from the heating element (vertically/distant region), creating a spatial separation between the pressure source and the circuit board contact point. This dimensional arrangement allows pressure to be contained in the sealed space while the circuit board remains undisturbed in another spatial dimension
2Productivity
If a housing is mounted on a circuit board to seal coolant, then cooling performance is improved, but wiring may be cut due to circuit board deformation
Solution Approach 1:
Segmenting the housing into upper and lower portions with the coupling portion positioned away from the heating element reduces stress transmission to the circuit board, preventing wiring cuts and maintaining both cooling performance and wiring integrity
Solution Approach 2:
The structural design of the coupling portion positioned at a distant region acts as a buffer that absorbs and distributes pressure before it can reach the circuit board, preventing deformation and wiring damage before they occur
3Temperature
If a housing seals coolant with respect to a circuit board, then heat dissipation is improved, but coolant may leak due to gap formation
Solution Approach 1:
Dividing the housing into coupled upper and lower housings creates multiple sealing interfaces and distributes thermal and pressure stresses, preventing gap formation and coolant leakage while maintaining effective heat dissipation through the sealed coolant system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses deformation of the circuit board, preventing coolant leakage and wiring damage, and enhances cooling efficiency by utilizing the latent heat of phase change, thereby maintaining system integrity and performance.
Implementation Method 1
enhances cooling efficiency by utilizing the latent heat of phase change
Implementation Method 2
enhances cooling efficiency by utilizing the latent heat of phase change
Data Source
AI summary
Electronic equipment 100 includes a circuit board 10, a first housing 20, and a deformation suppressing portion 30. A heating element H is mounted on the circuit board 10. The first housing 20 is mounted on a first main surface 11 of the circuit board 10 in such a way that the heating element H and a coolant COO are sealed with respect to the first main surface 11. The deformation suppressing portion 30 suppresses deformation of the circuit board 10. According to this configuration, it is possible to suppress a failure such as leakage of a coolant and cutting of a wiring formed on a circuit board, even when a heating element and a coolant are sealed in a space surrounded by the circuit board and a housing.