Circuit Board Dielectric Layer Reduces Insertion Loss
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Solution Overview
Problem
Traditional circuit boards experience excessive transmission loss when handling high-frequency signals, making them inadequate for modern electronic applications and necessitating an improvement in signal transmission integrity and manufacturing efficiency.
Innovation Solution
Incorporating a dielectric layer with a relative dielectric constant between 1 and 10, made from materials like epoxy resin or polyimide, between the circuit board body and the shielding film layer to reduce signal attenuation and insertion loss, while maintaining a simple manufacturing process and low costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional circuit board structure is used, then the manufacturing process is simple and cost is low, but the insertion loss is excessive and signal transmission integrity is poor
Solution Approach 1:
A dielectric layer with relative dielectric constant between 1-10 is introduced as an intermediary between the circuit board body and shielding film layer. This dielectric layer acts as a mediator that reduces signal attenuation and insertion loss without requiring complex manufacturing processes, thereby improving signal transmission integrity while maintaining structural simplicity
Solution Approach 2:
The patent changes the dielectric parameter (relative dielectric constant) to a specific range of 1-10 for the dielectric layer. This parameter optimization enables the circuit board to achieve low insertion loss and good signal transmission integrity at high frequencies, resolving the contradiction between signal quality and structural complexity
2Reliability
If the dielectric layer is made from common materials like epoxy resin or polyimide, then the manufacturing cost remains low and process stays simple, but achieving low insertion loss at high frequencies was previously impossible
Solution Approach 1:
The patent specifies that the dielectric layer should have a relative dielectric constant between 1-10, which is a parameter optimization that can be achieved using common materials like epoxy resin or polyimide. This allows high-frequency signal transmission with low insertion loss while maintaining ease of manufacture and low cost
Solution Approach 2:
The circuit board employs a composite structure consisting of the circuit board body, dielectric layer, and shielding film layer. By combining these layers with specific material properties (dielectric constant 1-10), the patent achieves high-frequency signal transmission capability while using materials that are easy to manufacture and cost-effective
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces insertion loss and ensures desirable signal transmission integrity for high-frequency signals, while keeping the manufacturing process straightforward and cost-effective, as demonstrated by experimental results showing reduced insertion loss across various frequency ranges.
Implementation Method 1
a dielectric layer, where the dielectric layer is arranged between the circuit board body and the shielding film layer
Implementation Method 2
the dielectric layer has a relative dielectric constant in a range of 1 to 10
Data Source
AI summary
A circuit board and an electronic device are provided. The circuit board includes a circuit board body (10) and a shielding film layer (11), and further includes a dielectric layer (12), where the dielectric layer (12) is arranged between the circuit board body (10) and the shielding film layer (11).