Circuit Board Dual-Surface Thermal Management for Image Formers
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Solution Overview
Problem
Existing circuit boards in image forming apparatuses face challenges with heat dissipation, leading to operational failures such as thermal shutdown and failure occurrence, especially when electronic parts are mounted exclusively on surfaces with low heat dissipation.
Innovation Solution
The circuit board design includes separate mounting areas on different surfaces for electronic parts, with one surface having higher heat dissipation than the other, allowing for the strategic placement of electronic parts with varying heat dissipation capabilities to minimize temperature risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic parts are mounted on a circuit board surface with low heat dissipation, then the circuit board can be designed with simpler structure, but temperature rise occurs leading to thermal shutdown and operational failures
Solution Approach 1:
The circuit board is designed with differentiated mounting surfaces where one surface has higher heat dissipation capability than the other. Electronic parts with different heat dissipation requirements are strategically assigned to different surfaces, creating local quality variations that optimize thermal management for each component type.
Solution Approach 2:
The invention utilizes the third dimension (vertical separation between two circuit board surfaces) to solve the heat dissipation problem. By distributing electronic parts across two surfaces with different thermal characteristics, the design transforms a two-dimensional mounting problem into a three-dimensional thermal management solution.
2Temperature
If electronic parts are strategically placed on surfaces with appropriate heat dissipation, then temperature rise is suppressed, but circuit board design complexity increases
Solution Approach 1:
The circuit board is segmented into two distinct mounting surfaces with different heat dissipation properties. This segmentation allows electronic parts to be distributed according to their thermal requirements, simplifying the overall thermal management strategy while maintaining design efficiency.
3Temperature
If electronic parts are mounted on high heat dissipation surface, then temperature rise is reduced, but mounting area availability is limited
Solution Approach 1:
The invention merges the mounting functions of two circuit board surfaces, utilizing both surfaces for electronic part mounting. The high heat dissipation surface accommodates temperature-sensitive components, while the low heat dissipation surface provides additional mounting area for other components, effectively combining the capabilities of both surfaces to maximize overall mounting capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses temperature rises in electronic parts, reducing the risk of operational failures like thermal shutdown, while maintaining the circuit board's heat dissipation performance without increasing complexity or cost.
Implementation Method 1
heat dissipation of the first mounting surface is higher than heat dissipation of the second mounting surface
Data Source
AI summary
A circuit board includes a first mounting area to which a first electronic part having at least a first function is mountable, and a second mounting area to which a second electronic part having higher heat dissipation than the first electronic part and at least the first function is mountable, wherein the first mounting area is provided on a first mounting surface of the circuit board, wherein the second mounting area is provided on a second mounting surface of the circuit board, the second mounting surface being different from the first mounting surface, and wherein heat dissipation of the first mounting surface is higher than heat dissipation of the second mounting surface.