Circuit Board Dummy Openings for Gas Removal
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Solution Overview
Problem
Conventional circuit boards face issues with residual basic gas at the interface between the insulating layer and the metal layer, leading to thermal stress, bonding failure, and warpage problems, which affect the reliability and plating deviation of the circuit pattern layer.
Innovation Solution
A circuit board design featuring a first insulating layer with a dummy region containing dot-shaped openings that vertically overlap the electrode, allowing for gas removal and improved bonding strength, plating deviation, and warpage properties by optimizing the curing temperatures of multiple insulating layers during lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electroless chemical copper plating is used to form metal layer for miniaturization, then circuit integration is improved, but residual basic gas remains at the interface between insulating layer and metal layer causing reliability issues
Solution Approach 1:
The patent introduces dummy patterns and openings in the insulating layer before the lamination process. These structures serve as preliminary gas escape routes that prevent gas entrapment during subsequent manufacturing steps, thereby eliminating the reliability issue caused by residual basic gas while maintaining the benefits of electroless chemical copper plating for circuit miniaturization
2Ease of manufacture
If residual basic gas remains at the interface between insulating layer and metal layer, then manufacturing process is simplified, but thermal stress and bonding failure occur
Solution Approach 1:
The patent extracts the harmful residual basic gas from the interface between insulating layer and metal layer by providing dedicated gas escape routes through dummy patterns with openings. This extraction mechanism allows the manufacturing process to remain simple while preventing bonding failure and thermal stress that would otherwise occur due to gas entrapment
3Device complexity
If conventional lamination process is used without gas removal structures, then manufacturing complexity is reduced, but warpage and stress occur during lamination
Solution Approach 1:
The patent incorporates dummy patterns with openings in the insulating layer as preliminary gas venting structures before lamination. These pre-designed features provide gas escape paths during the lamination process, preventing warpage and stress without significantly increasing manufacturing complexity, thereby maintaining lamination stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively removes residual gas, enhances bonding strength, minimizes thermal stress, and improves the warpage property of the circuit board by degassing and adjusting the curing temperatures of the insulating layers, thereby improving the reliability and assembly process of the circuit board.
Implementation Method 1
the first opening pass through upper and lower surfaces of the first electrode... capable of removing basic gas remaining between the insulating layer and the circuit pattern layer
Data Source
AI summary
A circuit board according to an embodiment includes a first insulating layer including a first region and a second region; and a first circuit pattern layer disposed on the first insulating layer; wherein the first circuit pattern layer includes a first electrode disposed on the first region of the first insulating layer and including a first opening, and wherein the first opening pass through upper and lower surfaces of the first electrode.